Product Specification

Product Introduction

High precision laser drilling machine achieves the smallest focused laser spot through beam expansion and focusing and utilizes a control system to perform laser micromachining, laser drilling, and laser cutting. The complete system is equipped with one control computer, specialized software for laser drilling, and software for precision laser cutting. The software interface is user-friendly, allowing users to set parameters such as aperture size, drilling thickness and angle, drilling speed, and laser frequency. It features graphical display of drilling patterns, process tracking functionality, and supports G-code programming or automatic programming via CAD file input, making it easy to operate.

High precision laser drilling machine's main features include high drilling precision, minimal heat-affected zones, and powerful software functionality, which can meet the needs of laser micro-drilling for most materials. The system includes precision X, Y, and Z motion stages, which use precision ball screws and linear guides. The X and Y axes have a travel range of 50 mm, and the Z axis also has a travel range of 50 mm, with a repeatability of <±2 microns.

Operating Conditions:

• Suitable for operation in an environment with a temperature range of 18°C to 28°C and a relative humidity of 30% to 60%.
• Compatible with a power supply of 220V, 50Hz, 10A (single-phase).
• Equipped with a plug that complies with relevant Chinese standards. If such a plug is not available, an appropriate adapter must be provided.

High precision laser drilling machine is widely used in various industries for drilling applications, including diamond wire drawing dies, slow wire EDM dies, silencer micro-holes, needle micro-holes, gemstone bearings, nozzles, and more.

Physical Structure

Applications

Ultra-Hard Material Processing

• Diamond Wire Drawing Dies: Micron-level hole drilling for enhanced wire accuracy.
• Gemstone Bearings/Nozzles: Crack-free drilling of brittle materials like ruby and sapphire.

High-Temperature-Resistant Material Processing

• Aerospace Components: Cooling holes in rhenium alloys and superalloys.
• Industrial Nozzles: High-density microhole arrays in stainless steel and carbon steel.

Precision Industrial Fields

• Medical Devices: Microholes in needles and drug atomization nozzles.
• Electronics: Through-holes and cutting in ceramic substrates and semiconductor materials.

Q&A

Q1: Can this machine process non-metallic materials (e.g., ceramics, polymers)?

A1: Yes. It handles ceramics, polycrystalline diamond, etc. Laser parameters (e.g., reduced power, shorter pulses) must be adjusted based on material thermal conductivity.

Q2: How to ensure accuracy in high aspect ratio (deep hole) machining?

A2: Uses Z-axis dynamic focusing + layered machining technology to remove material layer-by-layer and evacuate debris, preventing thermal buildup-induced deviations.

Q3: Does it support non-circular holes (e.g., tapered or square holes)?

A3: Yes. Built-in taper control algorithms adjust laser incidence angles and motion paths for complex geometries.

Q4: Are power and environmental conditions critical for operation?

A4: Requires stable 220V/50Hz power (voltage stabilizer recommended). Optimal environment: 18–28°C, 30–60% humidity to maintain optical stability.

Q5: How to minimize thermal damage during machining?

A5: Ultrafast pulses (picosecond/femtosecond) reduce heat diffusion. Software adjusts pulse intervals to enhance cooling.