Shenzhen Zhongtenghuakong Technology Co., Ltd.
Products
Manufacturer of a wide range of products which include CEM-1 CEM-3 Electronics PCB Assembly Multifunctional Durable,ROSH Keyboard Electronic Assembly PCB , Piano Prototype Circuit Board Assembly,Multipurpose SMT Conformal Coating ...
MOQ: 2pcs
Price: USD10-USD100
| Payment Terms | L/C, T/T |
| Supply Ability | 5000PCS/WEEK |
| Delivery Time | 20 workdays |
| Packaging Details | Inner packing :bubble bag Outer packing :Standard carton box |
| Copper Thickness | 1 oz, 35um |
| Min. Hole Size | 0.3mm |
| Tolerance of Etching | ±1mil(±25um) |
| Impedance control and tolerance | 50Ω±10% |
| Component Packaging | Cut Tape,Tube,Reels,Loose Parts |
| Material | FR-4/HTG150-180 FR-4/CEM-1/CEM-3/Aluminum |
| Board Thickness | 0.2mm- 4.0mm |
| Board Thickness Tolerance | +/-10% |
| Brand Name | OEM |
| Model Number | HKCC2211YH99 |
| Certification | SGS, RoHS, ISO9001-2000 |
| Place of Origin | China |
MOQ: 2pcs
Price: USD10-USD100
| Payment Terms | L/C, T/T |
| Supply Ability | 5500PCS/WEEK |
| Delivery Time | 20 workdays |
| Packaging Details | Inner packing :bubble bag Outer packing :Standard carton box |
| Insulation resistance | 1E+12Ω (normal condition) |
| Thermal shock endurance | 288 3 times in 10sec |
| Max Board twist and wrap | ≤0.7% |
| High Vlotage endurance | 1.3KV/mm |
| Copper foil peel off endurance | 1.4N/mm |
| Hardness of resist ink | ≥6H |
| Flame resistance | 94V-0 |
| Testing Service | 100% Electrical Test |
| Brand Name | OEM Customized |
| Model Number | HKCC2211YH98 |
| Certification | ROSH , ISO9001, Reach |
| Place of Origin | China |
MOQ: 2pcs
Price: USD10-USD100
| Payment Terms | T/T |
| Supply Ability | 5000PCS/WEEK |
| Delivery Time | 20 workdays |
| Packaging Details | Inner packing :bubble bag Outer packing :Standard carton box |
| Type of service | Turn-key, patail Turn-key or Consignment |
| Component Packaging | cute tape, tube , reels,loose parts |
| Certificate | ROHS,ISO14001:2004,ISO9001:2000 |
| Types of Solder | lead-free (RoHS Compliant) assembly services |
| Component Footprint | 01005,0201,0402 ,BGA,QFN |
| Min. Line Width | 3mil-10mil |
| Surface Finishing | HASL\OSP\immersion Gold |
| Ball Grid Array (BGA) | As small as 0.5mm pitch |
| Brand Name | OEM Customized |
| Model Number | HKCC2211YH169 |
| Certification | ISO/RoHS/TS16949 |
| Place of Origin | China |
MOQ: 2pcs
Price: USD10-USD100
| Payment Terms | T/T |
| Supply Ability | 5000PCS/WEEK |
| Delivery Time | 20 workdays |
| Packaging Details | Inner packing :bubble bag Outer packing :Standard carton box |
| Min. Solder Mask Bridge | 0.0762mm |
| Min. Mech Drill Size | 0.10mm |
| Package | Vacuum plastic bag,high standard carton |
| Solder Type | Water soluble solder paste, Lead-free |
| Bare board Size | smallest: 0.25*0.25inchs , largest :20*20inch |
| Parts Package | Reels, Cut Tape, Tube & Tray, Loose Parts and Bulk |
| Files formats | bill of material,gerber files,pick-N-place file |
| Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
| Brand Name | OEM Customized |
| Model Number | HKCC2211YH168 |
| Certification | ISO/RoHS/TS16949 |
| Place of Origin | China |
MOQ: 2pcs
Price: USD10-USD100
| Payment Terms | T/T |
| Supply Ability | 5000PCS/WEEK |
| Delivery Time | 20 workdays |
| Packaging Details | Inner packing :bubble bag Outer packing :Standard carton box |
| Size | 50*50mm~400mm * 1200mm |
| BGA Package | Dia. 0.14mm, BGA 0.2mm pitch |
| SMT Capacity | 3 Million~4 Million Soldering Pad/day |
| DIP Capacity | 100 Thousand Pins/day |
| Assembly Capacity | 100 Thousand Pins/day |
| Parts Package | Reels, Cut Tape, Tube & Tray, Loose Parts and Bulk |
| Testing | AOI ; X-RAY ; Functional Testing, ICT |
| Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
| Brand Name | OEM Customized |
| Model Number | HKCC2211YH167 |
| Certification | ISO/RoHS/TS16949 |
| Place of Origin | China |
MOQ: 2pcs
Price: USD10-USD100
| Payment Terms | T/T |
| Supply Ability | 5000PCS/WEEK |
| Delivery Time | 20 workdays |
| Packaging Details | Inner packing :bubble bag Outer packing :Standard carton box |
| PCB Max. size | 510mm*1200mm(SMT) |
| Chip component | 0201, 0402, 0603, 0805, 1206 package |
| Min.pin space of IC | 0.1mm |
| Min. space of BGA | 0.1mm |
| Max.precision of IC assembly | ±0.01mm |
| Assembly capacity | ≥8 million piots/day |
| DIP capacity | 6 DIP production lines |
| Assembly testing | Bridge test,AOI test, X-Ray test, ICT |
| Brand Name | OEM Customized |
| Model Number | HKCC2211YH166 |
| Certification | ISO/RoHS/TS16949 |
| Place of Origin | China |
MOQ: 2pcs
Price: USD10-USD100
| Payment Terms | T/T |
| Supply Ability | 5000PCS/WEEK |
| Delivery Time | 20 workdays |
| Packaging Details | Inner packing :bubble bag Outer packing :Standard carton box |
| Outline profile | Rout/ V-cut/ Bridge/ Stamp hole |
| Silkscreen | White, Black, Blue,Yellow |
| Package | vacuum package/ESD package |
| Service | EMS.ODM.OEM |
| Max board size(mm) | 1200x400mm |
| Board Thickness | 0.4mm--7mm |
| Minimum line/space | 0.075mm |
| Min.Hole Size | 0.15mm PTH |
| Brand Name | OEM Customized |
| Model Number | HKCC2211YH165 |
| Certification | ISO/RoHS/TS16949 |
| Place of Origin | China |
MOQ: 2pcs
Price: USD10-USD100
| Payment Terms | T/T |
| Supply Ability | 5000PCS/WEEK |
| Delivery Time | 20 workdays |
| Packaging Details | Inner packing :bubble bag Outer packing :Standard carton box |
| Outline Tolerance | ±0.05mm L≤25mm |
| Trace Width Tolerance | ±0.03mm W±30% |
| Min. Gap between Trace and Outline | 0.2mm |
| Min. Gap between Cover Layer and Pad | 0.1mm |
| Min. PTH Hole Ring | 0.45mm |
| Min.Hole Size | 0.15mm PTH |
| Min.Line Width | 0.05mm |
| Mini thickness | 0.08mm |
| Brand Name | OEM Customized |
| Model Number | HKCC2211YH164 |
| Certification | ISO/RoHS/TS16949 |
| Place of Origin | China |
MOQ: 2pcs
Price: USD10-USD100
| Payment Terms | T/T |
| Supply Ability | 5000PCS/WEEK |
| Delivery Time | 20 workdays |
| Packaging Details | Inner packing :bubble bag Outer packing :Standard carton box |
| Way of shipping | EMS/UPS/DHL/Fedex |
| Package | vacuum package/ESD package |
| PCB Assembly process | SMT THT DIP |
| Frequency of stencil cleaning | 1 time/5 to 10 pieces |
| QFP lead pitch | 0.38mm (minimum), 2.54mm (maximum) |
| Minimum chip size | 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) |
| Minimum IC pitch | 0.30mm |
| Surface Treatment | ENIG,Gold Plating,HAL,Plating Pb-Sn |
| Brand Name | OEM Customized |
| Model Number | HKCC2211YH163 |
| Certification | ISO/RoHS/TS16949 |
| Place of Origin | China |
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