ShenZhen KaiZhuo Electronic Technology Co.,Ltd
| Payment Terms | T/T, Western Union, MoneyGram, L/C, D/A |
| Supply Ability | 2000 m2 / Month |
| Delivery Time | 3-14 days |
| Packaging Details | vacuum package |
| Layer Count | 2 ` 30 Layers |
| Max Board Size | 600 mm x 1200 mm |
| Base Material for PCB | FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material |
| Rang of Finish Baords Thickness | 0.21-7.0mm |
| Minimum Line Width | 3mil (0.075mm) |
| Minimum Line Space | 3mil (0.075mm) |
| Minimum Hole Diameter | 0.10 mm |
| Finishing Treatment | HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc. |
| Thickness Of Copper | 0.5-14oz (18-490um) |
| E-Testing | 100% E-Testing (High Voltage Testing); Flying Probe Testing |
| Brand Name | KAZ |
| Model Number | KAZA-B-100 |
| Certification | UL&ROHS |
| Place of Origin | China |
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Product Specification
| Payment Terms | T/T, Western Union, MoneyGram, L/C, D/A | Supply Ability | 2000 m2 / Month |
| Delivery Time | 3-14 days | Packaging Details | vacuum package |
| Layer Count | 2 ` 30 Layers | Max Board Size | 600 mm x 1200 mm |
| Base Material for PCB | FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material | Rang of Finish Baords Thickness | 0.21-7.0mm |
| Minimum Line Width | 3mil (0.075mm) | Minimum Line Space | 3mil (0.075mm) |
| Minimum Hole Diameter | 0.10 mm | Finishing Treatment | HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc. |
| Thickness Of Copper | 0.5-14oz (18-490um) | E-Testing | 100% E-Testing (High Voltage Testing); Flying Probe Testing |
| Brand Name | KAZ | Model Number | KAZA-B-100 |
| Certification | UL&ROHS | Place of Origin | China |
| High Light | blind via pcb ，hdi pcb | ||
HDI printed circuit boards prototype and mass production manufacturer PCB Assembly Service
Features
1. One Stop OEM Service, Made in Shenzhen of China
2. Manufactured by Gerber File and BOM List from Customer
3. FR4 Material, Meet 94V0 standard
4. SMT, DIP technology suport
5. Lead Free HASL, Environmental Protection
6. UL, CE, ROHS Compliant
7. Shipping By DHL,UPS, TNT, EMS or Customer requirement
PCB Technical capability
| SMT | Position accuracy:20 um |
| Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP | |
| Max. component height::25mm | |
| Max. PCB size:680×500mm | |
| Min. PCB size:no limited | |
| PCB thickness:0.3 to 6mm | |
| PCB weight:3KG | |
| Wave-Solder | Max. PCB width:450mm |
| Min. PCB width: no limited | |
| Component height:Top 120mm/Bot 15mm | |
| Sweat-Solder | Metal type :part, whole, inlay, sidestep |
| Metal material:Copper , Aluminum | |
| Surface Finish:plating Au, plating sliver , plating Sn | |
| Air bladder rate:less than20% | |
| Press-fit | Press range:0-50KN |
| Max. PCB size:800X600mm | |
| Testing | ICT,Probe flying,burn-in,function test,temperature cycling |
HDI printed circuit boards, also known as microvia or μvia PCBs, are an advanced PCB technology that enable high-density interconnections and miniaturized electronic components.
Key features and functions of HDI printed circuit boards include:
Miniaturization and increased density:
HDI PCBs feature smaller, more closely spaced vias and vias, allowing for higher interconnect density.
This makes it possible to design more compact, space-saving electronic devices and components.
Microvias and Stacked Vias:
HDI PCBs use microvias, which are smaller, laser-drilled holes that are used to connect different layers of the PCB.
Stacked vias, where multiple vias are stacked vertically, can further increase interconnect density.
Multi-layer structure:
HDI PCBs can have a higher layer count than traditional PCBs, typically 4 to 10 or more.
The increased number of layers allows for more complex routing and more connections between components.
Advanced materials and processes:
HDI PCBs often use specialized materials such as thin copper foil, high-performance laminates, and advanced plating techniques.
These materials and processes enable the creation of smaller, more reliable, higher-performance interconnects.
Improved electrical properties:
The reduced trace widths, shorter signal paths, and tighter tolerances of HDI PCBs help improve electrical performance, including improved signal integrity, reduced crosstalk, and faster data transmission.
Reliability & Manufacturability:
HDI PCBs are designed for high reliability, with features like improved thermal management and enhanced mechanical stability.
Manufacturing processes for HDI PCBs, such as laser drilling and advanced plating techniques, require specialized equipment and expertise.
HDI printed circuit board applications include:
Smartphones, Tablets, and Other Mobile Devices
Wearable Electronics and IoT (Internet of Things) Devices
Automotive electronics and advanced driver assistance systems (ADAS)
High speed computing and telecommunications equipment
Military and aerospace electronic equipment
Medical devices and instruments
The continued demand for miniaturization, enhanced functionality, and higher performance in a variety of electronic products and systems has driven the adoption of HDI PCB technology.
PCB Pictures
Company Details
Business Type:
Manufacturer
Year Established:
2007
Total Annual:
8,800,000-11,000,000
Employee Number:
300~350
Ecer Certification：
Verified Supplier
In the year of 2024, SHENZHEN KAIZUO ELECTRONIC TECHNOLOGY CO., LTD (KAZ CIRCUIT) has joined Kingsum group (www.kingsumpcba.com), to seek for a larger market share from PCB manufacturing, component sourcing, pcb assembly, and box build assembly with better price and lead time. Founded in 2007, Ka... In the year of 2024, SHENZHEN KAIZUO ELECTRONIC TECHNOLOGY CO., LTD (KAZ CIRCUIT) has joined Kingsum group (www.kingsumpcba.com), to seek for a larger market share from PCB manufacturing, component sourcing, pcb assembly, and box build assembly with better price and lead time. Founded in 2007, Ka...
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