ShenZhen KaiZhuo Electronic Technology Co.,Ltd
| Payment Terms | T/T, Western Union, MoneyGram, L/C, D/A |
| Supply Ability | 2000 m2 / Month |
| Delivery Time | 10 ~ 20 wprking days |
| Packaging Details | P/P , Carton |
| Layer Count | 2 ` 30 Layers |
| Max Board Size | 600 mm x 1200 mm |
| Base Material for PCB | FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material |
| Rang of Finish Baords Thickness | 0.21-7.0mm |
| Minimum Line Width | 3mil (0.075mm) |
| Minimum Line Space | 3mil (0.075mm) |
| Minimum Hole Diameter | 0.10 mm |
| Finishing Treatment | HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc. |
| Thickness Of Copper | 0.5-14oz (18-490um) |
| E-Testing | 100% E-Testing (High Voltage Testing); Flying Probe Testing |
| Brand Name | KAZ |
| Model Number | KAZA-B-007 |
| Certification | UL&ROHS |
| Place of Origin | China |
View Detail Information
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Product Specification
| Payment Terms | T/T, Western Union, MoneyGram, L/C, D/A | Supply Ability | 2000 m2 / Month |
| Delivery Time | 10 ~ 20 wprking days | Packaging Details | P/P , Carton |
| Layer Count | 2 ` 30 Layers | Max Board Size | 600 mm x 1200 mm |
| Base Material for PCB | FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material | Rang of Finish Baords Thickness | 0.21-7.0mm |
| Minimum Line Width | 3mil (0.075mm) | Minimum Line Space | 3mil (0.075mm) |
| Minimum Hole Diameter | 0.10 mm | Finishing Treatment | HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc. |
| Thickness Of Copper | 0.5-14oz (18-490um) | E-Testing | 100% E-Testing (High Voltage Testing); Flying Probe Testing |
| Brand Name | KAZ | Model Number | KAZA-B-007 |
| Certification | UL&ROHS | Place of Origin | China |
| High Light | printed circuit board pcb ，power supply circuit board | ||
Heavey Copper PCB printed circuit board PCB Assembly Service PCBA Design PCB Assembly Service
Features
PCBA Technical capability
| SMT | Position accuracy:20 um |
| Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP | |
| Max. component height::25mm | |
| Max. PCB size:680×500mm | |
| Min. PCB size:no limited | |
| PCB thickness:0.3 to 6mm | |
| PCB weight:3KG | |
| Wave-Solder | Max. PCB width:450mm |
| Min. PCB width: no limited | |
| Component height:Top 120mm/Bot 15mm | |
| Sweat-Solder | Metal type :part, whole, inlay, sidestep |
| Metal material:Copper , Aluminum | |
| Surface Finish:plating Au, plating sliver , plating Sn | |
| Air bladder rate:less than20% | |
| Press-fit | Press range:0-50KN |
| Max. PCB size:800X600mm | |
| Testing | ICT,Probe flying,burn-in,function test,temperature cycling |
Following are the key steps of Heavy Copper PCB Assembly Service:
Materials and Components:
High Copper Content PCB (2oz, 4oz or 6oz copper thickness)
Heavy Electronic Components (e.g. Power Transistors, High Power Resistors, Heat Sinks)
High Temperature Solder (e.g. High Melting Point Lead-Free Solder)
High Quality Solder Paste
PCB Assembly Process:
PCB Preparation:
Clean PCB surface thoroughly to remove any contaminants.
Apply solder mask and silk screen as per component placement requirements.
Drill and through holes for component leads and mounting.
Component Placement:
Carefully place components on PCB ensuring proper orientation and alignment.
Secure component leads to PCB pads using high temperature solder paste.
Reflow Soldering:
Place assembled PCB in reflow oven or use hot air rework station.
Heat PCB to appropriate reflow temperature (usually 230°C to 260°C) to melt solder paste.
Ensure proper solder wetting and joint formation for all component connections.
Inspection and Testing:
Visually inspect the PCB for any solder bridges, cold joints, or missing components.
Perform electrical tests to verify the functionality of the circuit, such as continuity, resistance, and voltage measurements.
Perform any necessary functional tests to ensure the circuit meets design specifications.
Thermal Management:
Identify high-power components that require additional cooling.
Install heat sinks or other thermal management solutions as needed to effectively dissipate heat.
Ensure proper thermal interface between components and heat sink.
Conformal Coating (Optional):
Apply conformal coatings, such as acrylic or polyurethane, to protect the PCB and components from environmental factors such as moisture, dust, and corrosion.
Final Assembly and Packaging:
Secure the PCB in a suitable housing or enclosure, if required.
Pack the assembled PCB for safe shipping and delivery.
Key Considerations for Heavy Copper PCB Assembly:
Ensure the PCB material and copper thickness are appropriate for the power requirements of the application.
Select components with appropriate power ratings and heat dissipation capabilities.
Use high-temperature solder and solder paste to withstand higher operating temperatures.
Implement proper thermal management solutions to prevent components from overheating.
PCBA Pictures
Company Details
Business Type:
Manufacturer
Year Established:
2007
Total Annual:
8,800,000-11,000,000
Employee Number:
300~350
Ecer Certification：
Verified Supplier
In the year of 2024, SHENZHEN KAIZUO ELECTRONIC TECHNOLOGY CO., LTD (KAZ CIRCUIT) has joined Kingsum group (www.kingsumpcba.com), to seek for a larger market share from PCB manufacturing, component sourcing, pcb assembly, and box build assembly with better price and lead time. Founded in 2007, Ka... In the year of 2024, SHENZHEN KAIZUO ELECTRONIC TECHNOLOGY CO., LTD (KAZ CIRCUIT) has joined Kingsum group (www.kingsumpcba.com), to seek for a larger market share from PCB manufacturing, component sourcing, pcb assembly, and box build assembly with better price and lead time. Founded in 2007, Ka...
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