OEM Mobile phone Blue Soldermask White Silkscreen FR4 Electronic Printed Circuit

Product Specification

OEM Mobile phone Blue Soldermask White Silkscreen FR4 Electronic Printed Circuit Board

Detail specification about Mobilephone Blue Soldermask White Silkscreen FR4 Electronic Printed Circuit Board

Brief introduction about Shenzhen KAZ Circuit Co,. Ltd.

Brief introduction

    Shenzhen KAZ Circuit Co., Ltd, found in 2007, is a PCB and PCBA custom-made manufacturer. It's commitment to high precision single, double-sided, multilayer printed circuit board and metal substrate circuit board production,which is a hightech enterprises including amnufacture, sales, service and so on.

    We are confident to provide you quality products with factory-directed price within the fastest delivery time!

What KAZ Circuit can do for you:

• PCB manufacturing (prototype, small to medium, mass production)
• Components Sourcing
• PCB Assembly/SMT/DIP

To get a full quotation of the PCB/PCBA, pls provide the information as below:

• Gerber File, with detail specification of the PCB
• BOM List (Better with excel fomart)
• Photoes of the PCBA (If you have done this PCBA before)

Company Informaiton:

    KAZ Circuit is a professional PCB manufacturer from China since 2007, also provide PCB Assembly service for our customers. Now with about 300 employees. Certified with ISO9001,TS16949, UL, RoHS. We are confident to provide you quality products with factory-directed price within the fastest delivery time!

Manufacturer Capacity:

Electronic printed circuit board (PCB) manufacturing processes:
PCB material choice:
    Common base materials include FR-4 (fiberglass), polyimide and ceramics
    Consider properties such as dielectric constant, thermal performance, and flexibility
    Special materials available for high-frequency, high-power or flexible PCBs

Copper thickness and layer count:
    Typical copper foil thickness ranges from 1oz to 4oz (35µm to 140µm)
    Single-sided, double-sided and multilayer PCBs available
    Additional copper layers improve power distribution, heat dissipation and signal integrity

Surface Treatment:
    HASL (Hot Air Solder Leveling) - Affordable, but surface may not be flat
    ENIG (Electroless Nickel Immersion Gold) – provides excellent solderability and corrosion resistance
    Immersion Silver - Cost effective for lead-free soldering
    Additional options include ENEPIG, OSP and direct gold plating

Advanced PCB Technologies:
    Blind and Buried Vias for High Density Interconnects
    Microvia Technology for Ultra-Fine Pitch and Miniaturization
    Rigid-flex PCBs for applications that require flexibility
    High frequencies and high speeds with controlled impedance pc

PCB manufacturing technology:
    Subtractive process (most common) - etching away unwanted copper
    Additive process - creating copper traces on the base material
    Semi-additive process - combining subtractive and additive technologies

Design for Manufacturer (DFM):
    Adherence to PCB design guidelines for reliable manufacturing
    Considerations include trace width/spacing, via size and component location
    Close collaboration between designers and manufacturers is essential

QA and testing:
    Electrical testing (e.g., online testing, functional testing)
    Mechanical testing (e.g., bending, shock, vibration)
    Environmental testing (e.g., temperature, humidity, thermal cycles)

More photos