Suneast Intelligent Equipment Technology (Shenzhen) Co.Ltd
| Payment Terms | T/T |
| Delivery Time | 25~50 days |
| Packaging Details | Plywood crate |
| Name | IC Bonder |
| Model | WBD2200 |
| Machine dimension | 1255(L)*1625(W)*1610(H)mm |
| Placement accuracy | ±15um@3σ |
| Die size | 0.25*0.25mm-10*10mm |
| Substrate size | 150(L)*50(W)~300(L)*100(W)mm |
| Substrate thickness | 0.1~2mm |
| Placement pressure | 30～7500g |
| Glue feeding mode | dispensing，dipping glue，painting glue |
| Customizable | Yes |
| Brand Name | Suneast |
| Model Number | WBD2200 |
| Certification | CE、ISO |
| Place of Origin | Shenzhen, Guangdong Province, China |
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Product Specification
| Payment Terms | T/T | Delivery Time | 25~50 days |
| Packaging Details | Plywood crate | Name | IC Bonder |
| Model | WBD2200 | Machine dimension | 1255(L)*1625(W)*1610(H)mm |
| Placement accuracy | ±15um@3σ | Die size | 0.25*0.25mm-10*10mm |
| Substrate size | 150(L)*50(W)~300(L)*100(W)mm | Substrate thickness | 0.1~2mm |
| Placement pressure | 30～7500g | Glue feeding mode | dispensing，dipping glue，painting glue |
| Customizable | Yes | Brand Name | Suneast |
| Model Number | WBD2200 | Certification | CE、ISO |
| Place of Origin | Shenzhen, Guangdong Province, China | ||
| High Light | soldering combined multi module wave selective ，selective multi module combined wave soldering ，combined wave soldering selective multi module | ||
High Precision Multilayer Capability Quick Changeover IC Bonding Machine WBD2200
The IC bonder is used for multi-chip placement, with mature technology application platform, which offers higher accuracy with new vision system and thermal compensation algorithm, and higher speed through a new image processing unit and architecture.
Features:
Main application:
IC bonder is suit able for IC,WLCSP,TSV, SIP,QFN,LGA,BGA process products. Such as optical communication module, camera module, LED, power module, power de vice, vehicle electronics, 5G RF, memory, MEMS, various sensors, etc.
Product Parameters:
| Item | Specification |
| Placement accuracy | ±15um@3σ |
| Wafer size(mm) | 4"/6"/8"(Option:12") |
| Die size(mm) | 0.25*0.25mm-10*10mm |
| Substrate size(mm) | L150×W50~L300×W100 |
| Substrate thickness(mm) | 0.1~2mm |
| Placement head | 0-360°rotation/Auto change nozzle(option) |
| Placement pressure(N) | 30～7500g |
| Glue feeding mode | Support:dispensing,dipping glue,painting glue |
| Core motion module | Linear motor + grating scale |
| Platform base of machine | Marble platform |
| Loading/unloading | Manual/auto |
| Machine dimension(L×W×H) | 1255mm×1625mm×1610mm |
Notices:
1.Leakage protection switch: ≥100ma
2.Compressed air requirement: 0.4-0.6Mpa
Inlet pipe specification: Ø10mm
3.Vacuum requirement:<-88kPa
Inlet pipe specification: Ø10mm
Tracheal joint: 2 pieces
4.Power requirements:
①Voltage: AC220V, frequency 50/60HZ;
②Wire requirements: Three core power copper wire, wire diameter≥2.5mm², leakage protection switch 50A, leakage protection switch leakage≥100mA.
5.The ground is required to withstand a pressure of 800kg/m².
Company Details
Business Type:
Manufacturer
Year Established:
1984
Total Annual:
30000000-45000000
Employee Number:
300~500
Ecer Certification：
Verified Supplier
Founded in Hong Kong in 1984, Suneast technology established its industrial park in Shenzhen in 1999 and listed on the main board of Hong Kong stock exchange in 2000 (Stock Code: 0365. HK).The independent R&D products, like reflow oven, wave soldering machine, selective soldering... Founded in Hong Kong in 1984, Suneast technology established its industrial park in Shenzhen in 1999 and listed on the main board of Hong Kong stock exchange in 2000 (Stock Code: 0365. HK).The independent R&D products, like reflow oven, wave soldering machine, selective soldering...
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