Snap Curing Oven SEO-600N

Product Specification

Modular Remote Monitoring Snap Curing Oven SEO-600N Nitrogen Control

    The snap curing oven adopts modular design and combines different functions, like automatic temperature control, nitrogen protection, buffer cooling, automatic loading and unloading and so forth. Through the specific temperature control, atmosphere control and automatic operation, it can complete the process after Die Attach equipment, which is mainly used in curing and bonding of semi-conductor packaging.

Core technology:

01 Heating system: with 6 zones, the temperature of each zone can be set separately; the lead frame is arranged in single row matrix for curing.

02 Conveyor system: Separate and independent conveying system, automatic control, with buffer section, and automatic collecting mechanism.

03 Control system: PC+PLC electrical control system, Windows operating interface, Chinese and English online free switching, LCD display, support remote monitoring.

04 Protection system: The machine has a variety of protection mechanisms, including over temperature protection, three-color light, buzzer fault alarm and software interface fault prompt.

05 Nitrogen system: Configure the flow meter to adjust the flow into the box and monitor the nitrogen consumption.

Functional characteristics:

• Each product only needs to be adjusted one time, and the engineering parameters can be directly read
• For the next production, and the operation is simple and fast;
• The curing temperature is up to 250℃, to meet the temperature requirements of diverse products;
• The temperature deviation of each heating module is within ±5℃;
• Various fool-proofing alarm, software prompts, real-time observation of the alarm status;
• On-line temperature curve, the temperature of each module can be observed at any time;
• Gas flow and pressure software real-time display, easy for data tracking.

Product feature:

HEATING SYSTEM

①6 independent heating zones (the number of temperature zones can be optional) and independent PID temperature control to achieve different processes;

②Using contact heating module, the surface temperature is more uniform and the heat conduction rate is faster;

③Heating zone nitrogen protection, better to reduce product oxidation;

④Real-time online inspection of the temperature control system prevents low temperature and overtemperature situation.

SEMICONDUCTOR OVEN SAFETY PROTECTION SYSTEM

    It is equipped with separate and independent conveying system, easy maintenance and operation, the buffering module, conveying module in the oven, buffer transfer module, and collecting module. The straight-out or clip type collecting module is optional.

The cable transfer mechanism is used in the oven to reduce the contact area with the lead frame, and reduce the uneven heat conduction and temperature loss of the material during the transfer process.

ELECTRONIC CONTROL SYSTEM

    PC+PLC electrical control system, PID intelligent temperature control, SSR output control, stable and reliable;

Multiple protection functions consist of overtemperature alarm device, ground leakage circuit breaker, overheating protection and so on.

NITROGEN SYSTEM

    Real-time monitoring of nitrogen pressure and flow, equipped with adjustable flowmeter, easy to adjust the flow into the box;

The nitrogen in the oven is evenly distributed to avoid material oxidation.

SOFTWARE INTERFACE

①Support WIN10 operation system, with rich expansion;

②Using WPF framework, the UI interface is more beautiful;

③Man-machine interface is user-friendly and the interface is arranged into different modules according to the functions, easy to use;

④Armed with excellent production record and log saving function, easy to track in the future.

TEMPERATURE TEST OF SNAP CURING OVEN FOR SEMICONDUCTOR

    The actual temperature of each curing zone is tested within the set temperature range of ±3℃.

SNAP CURING OVEN FOR SEMICONDUCTOR CLEANNESS TEST

    The 0.5um particle diameter concentration is ≤35200 after testing, which meets the production requirements of high cleanliness class1000 dust-free cleanroom.

Product Parameters:

Notices:

1.Gas source requirements: Nitrogen working pressure (pressure during use)>0.5-0.8Mpa, nitrogen purity 99.999%.

2.Power requirements:

①Three phase five wire: voltage 380V, frequency 50/60HZ;

②Wire diameter above 25mm², leakage protection switch 100A, leakage protection switch leakage capacity 150-200mA.

3.Ground pressure requirement: 1000kg/m².

4.External ventilation requirements: 2-Ø38mm outer diameter air duct, ventilation volume of 2*5M³/min;

5.Environmental requirements: The ambient temperature range should be between 5-40℃, and the relative humidity range should be between 20-95%.