Suntek Electronics Co., Ltd.
Products
Manufacturer of a wide range of products which include 1-30Layer FR4 TG170 PC PCB Assembly for New Energy Equipment China and Cambodia,Rigid PCB Board Type PCBA Circuit Board Assembly SMT THT Turnkey Service in,Professional ICT Te...
MOQ: 5pcs
Price: USD1/PCS
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks after all parts collected |
| Packaging Details | 60*40*30cm cartons and ESD bags |
| Layer | 1-22 layers |
| Materials | CEM1, CEM3, FR-4, High Tg FR-4, Aluminum board |
| CE | ISO9001, ISO13485, TS16949 and UL E476377 |
| PCB thickness | 1.6 ±0.1mm |
| Max. board Thickness | 6.0mm |
| Surface finished | Lead free,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver |
| Brand Name | Suntek |
| Model Number | SBBF03 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: Based on Parts list
| Payment Terms | T/T,Paypal |
| Supply Ability | 100 pcs/hour |
| Delivery Time | 1-2 weeks after all parts collected |
| Packaging Details | 60*40*30cm cartons and ESD bags |
| Board Type | Rigid PCB, Flexible PCB, metal core PCB, Rigid-Flex PCB |
| Board Shape | Rectangular, Circular and any Odd Shapes |
| Size | Min 50*50mm to max 500mm*800mm |
| Package | Min 01005, 0201, 0402, 0603, 0805, 1206, max 18*18mm |
| Fine Pitch Parts | 0.25mm |
| BGA Package | Dia. 0.14mm, BGA 0.2mm pitch |
| Mounting Accuracy | ±0.035mm(±0.025mm) Cpk≥1.0 (3σ) |
| Stencils | Laser cut stainless steel stencils,Nano stencil ,FG stencil |
| Brand Name | Suntek |
| Model Number | SBBF0324 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: USD1/PCS
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 3-6 weeks |
| Packaging Details | cartons and ESD bags |
| Surface Finish | HASL, ENIG, OSP, Immersion Silver |
| Type | Printed Circuit Board Assembly |
| Testing | AOI,ICT,100% Visual Inspection，FT |
| Minimum Trace/Space | 4mil/4mil |
| Lead Time | 3-5 Days after all parts collected |
| Layers | 2-20 Layers |
| Maximum Copper Weight | 6oz |
| Minimum Hole Size | 0.2mm |
| Brand Name | Suntek |
| Model Number | FPA856 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China |
MOQ: 1
Price: Customized products
| Payment Terms | TT,Paypal |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material | FR4(Tg130-Tg180) |
| Thickness | 0.4mm-5mm |
| Layer | 1L-32L |
| Size at max. | 1200*400mm |
| LW/LS min. | 0.05mm |
| Copper | 0.5--10OZ |
| Surface | HASL,ENIG,OSP,Hard plating,Immersion Tin |
| Ability | SMT/THT/0201/BGA/AI |
| Brand Name | Suntek |
| Model Number | F016-008 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China or Cambodia |
MOQ: 1
Price: Customized products
| Payment Terms | TT,Paypal |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material | FR4(Tg130-Tg180) |
| Thickness | 0.4mm-5mm |
| Layer | 1L-32L |
| Size at max. | 1200*400mm |
| LW/LS min. | 0.05mm |
| Copper | 0.5--10OZ |
| Surface | HASL,ENIG,OSP,Hard plating,Immersion Tin |
| Ability | SMT/THT/0201/BGA/AI |
| Brand Name | Suntek |
| Model Number | F016-008 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China or Cambodia |
MOQ: 1
Price: Customized products
| Payment Terms | TT,Paypal |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material | FR4(Tg130-Tg180) |
| Thickness | 0.4mm-5mm |
| Layer | 1L-32L |
| Size at max. | 1200*400mm |
| LW/LS min. | 0.05mm |
| Copper | 0.5--10OZ |
| Surface | HASL,ENIG,OSP,Hard plating,Immersion Tin |
| Ability | SMT/THT/0201/BGA/AI |
| Brand Name | Suntek |
| Model Number | F016-009 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China or Cambodia |
MOQ: 1
Price: Customized products
| Payment Terms | TT,Paypal |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material | FR4(Tg130-Tg180) |
| Thickness | 0.4mm-5mm |
| Layer | 1L-32L |
| Size at max. | 1200*400mm |
| LW/LS min. | 0.05mm |
| Copper | 0.5--10OZ |
| Surface | HASL,ENIG,OSP,Hard plating,Immersion Tin |
| Ability | SMT/THT/0201/BGA/AI |
| Brand Name | Suntek |
| Model Number | F016-009 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China or Cambodia |
MOQ: 1
Price: Customized products
| Payment Terms | TT,Paypal |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material | FR4(Tg130-Tg180) |
| Thickness | 0.4mm-5mm |
| Layer | 1L-32L |
| Size at max. | 1200*400mm |
| LW/LS min. | 0.05mm |
| Copper | 0.5--10OZ |
| Surface | HASL,ENIG,OSP,Hard plating,Immersion Tin |
| Ability | SMT/THT/0201/BGA/AI |
| Brand Name | Suntek |
| Model Number | F016-009 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China or Cambodia |
MOQ: 5pcs
Price: USD1/PCS
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks after all parts collected |
| Packaging Details | Vacuum,Anti-static,ESD,Cartons |
| Silk | White |
| Inspection Standard | IPC Class II/ IPC Class III |
| Qty | Support Prototype And Batch Production |
| Impedance Control | 50/90/100±10% Ohm |
| Suface | ENIG 2U |
| Rohs Compliance | Yes |
| Maximum Size | 600mm*1200mm |
| Process | Immersion Gold/sliver/Assembly |
| Brand Name | Suntek |
| Model Number | F9632-31 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China |
MOQ: 5pcs
Price: Based on Gerber
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks after all parts collected |
| Packaging Details | 60*40*30cm cartons and ESD bags |
| Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
| Build-up Material | RCC,FR4 |
| Max Layer | 38L |
| Min Hole mm(mil) | 0.2(8) |
| Min Land mm(mil) | 0.4(16) |
| Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
| Laser Hole Filling | Yes |
| Max Copper Thickness | 8OZ |
| Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
| Brand Name | Suntek |
| Model Number | F566521 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
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