Dongguan Ziitek Electronical Material and Technology Ltd.
Payment Terms | T/T |
Supply Ability | 1000000 pcs/month |
Delivery Time | 3-5 work days |
Packaging Details | 24*13*12cm cartons |
Products name | Gray Soft Silicone Thermal Pad 6.5W High Thermal Conductivity For Electronics Cooling |
Thinkness range | 0.020"(0.50mm)~0.200"(5.00mm) |
Keywords | Silicone Thermal Pad |
Hardness | 20 Shore 00 |
Thermal Conductivity | 6.5W/mK |
Color | Gray |
Flam rating | 94 V-0 |
Application | Electronics Cooling |
Brand Name | Ziitek |
Model Number | TIF700NUS |
Certification | RoHS and UL recognized |
Place of Origin | China |
View Detail Information
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Product Specification
Payment Terms | T/T | Supply Ability | 1000000 pcs/month |
Delivery Time | 3-5 work days | Packaging Details | 24*13*12cm cartons |
Products name | Gray Soft Silicone Thermal Pad 6.5W High Thermal Conductivity For Electronics Cooling | Thinkness range | 0.020"(0.50mm)~0.200"(5.00mm) |
Keywords | Silicone Thermal Pad | Hardness | 20 Shore 00 |
Thermal Conductivity | 6.5W/mK | Color | Gray |
Flam rating | 94 V-0 | Application | Electronics Cooling |
Brand Name | Ziitek | Model Number | TIF700NUS |
Certification | RoHS and UL recognized | Place of Origin | China |
Gray Soft Silicone Thermal Pad 6.5W High Thermal Conductivity For Electronics Cooling
Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
TIF®700NUS series of thermal interface materials is specficlly designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, allowing it to conform tighty to heat sources with varying shapes and height differences. Even in confined or irregular spaces,it maintains stable thermal conductivity, enabling eficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink. This significantly improves the heat dissipation efficiency ofelectronic components, thereby enhancing operational stability and extending device lifespan.
Features:
> Excellent thermal conductivity 6.5W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> CPU And GPU processors and other chipsets
> Display card
> Mainboard/mother board
> Memory Modules
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
> LED Power Supply
Typical Properties of TIF®700NUS Series | ||
Color | Gray | Visual |
Construction & Compostion | Ceramic filled silicone elastomer | ****** |
Specific Gravity | 3.5g/cc | ASTM D297 |
thickness | 0.020"(0.50mm)~0.200"(5.00mm) | ASTM D374 |
Hardness (thickness<1.0mm) | 20 (Shore 00) | ASTM 2240 |
Continuos Use Temp | -45 to 200℃ | ****** |
Dielectric Breakdown Voltage | ≥6000 VAC | ASTM D149 |
Dielectric Constant | 4.5MHz | ASTM D150 |
Volume Resistivity | ≥1.0X10¹²Ohm-meter | ASTM D257 |
Fire rating | 94 V0 | equivalent UL |
Thermal conductivity | 6.5W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Q: How much are the pads?
A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.
Company Details
Business Type:
Manufacturer,Seller
Year Established:
2006
Total Annual:
1000000-16000000
Employee Number:
100~150
Ecer Certification:
Verified Supplier
Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S® ... Dongguan Ziitek Electronical Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent. Ziitek D-U-N-S® ...
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