TOP Electronic Industry Co., Ltd.
| Payment Terms | T/T, paypal or western Union |
| Supply Ability | 2,000pcs per month |
| Delivery Time | 2-3 working days after received the payment |
| Packaging Details | Packed in original tray firstly ,then carton, at last Bubble bag for outer packing |
| Product Name | 4G module LTE only |
| Chipset | Intel XMM 7160 |
| Size | 23 x 22 x 2.5 mm |
| Temperature Range | -40℃ to 85℃ |
| 4 bands | B2,B4,B5,B17 |
| Approvals | CE, GCF, Telstra |
| Brand Name | SIERRA WIRELESS |
| Model Number | HL7548 |
| Certification | FCC, PTCRB, GCF |
| Place of Origin | Germany |
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Product Specification
| Payment Terms | T/T, paypal or western Union | Supply Ability | 2,000pcs per month |
| Delivery Time | 2-3 working days after received the payment | Packaging Details | Packed in original tray firstly ,then carton, at last Bubble bag for outer packing |
| Product Name | 4G module LTE only | Chipset | Intel XMM 7160 |
| Size | 23 x 22 x 2.5 mm | Temperature Range | -40℃ to 85℃ |
| 4 bands | B2,B4,B5,B17 | Approvals | CE, GCF, Telstra |
| Brand Name | SIERRA WIRELESS | Model Number | HL7548 |
| Certification | FCC, PTCRB, GCF | Place of Origin | Germany |
| High Light | Sierra Wireless Module ，m2m wireless module | ||
LTE Cat 3 / Cat 4 4G LTE Module HL7548 with Intel XMM7160 Chipset
AirPrime® HL7548 Specifications
| Cellular | • LTE Cat 3/Cat4 |
| B2,B4,B5,B17 | |
| •Peak Download/ Upload Rate | |
| (100/50 Mbps) | |
| • Intel XMM 7160 | |
| • LTE Only Verizon | |
| • LTE triple band Cat3/Cat4 | |
| • FDD LTE | |
| • DL 2X2 | |
| Physical Characteristics | • 23 X 22 X 2.5 [mm] |
| Weight: | • 3.5g |
| Temperature ranges: | • Storage Temperature:–40C to +85C |
| Approval & Certification | • FCC, PTCRB, GCF |
| • AT&T |
The AirPrime HL7519, HL7548 and HL7588 belong to the AirPrime HL Series from Essential Connectivity Module family. These are industrial grade Embedded Wireless Modules that provide data connectivity on LTE, HSDPA and HSUPA networks.
Sierra Wireless AirPrime® HL7548 embedded module offers LTE only coverage for machine-to-machine (M2M) applications such as healthcare, point of sale terminals, fleet management, tracking, and consumer electronics.
Key differentiators:
· Smallest 2G to 4G pin-to-pin compatable module on the market
· Common form factor with optional snap-in socket to change modules anytime
· Low-power consumption and enhanced RF performance
· FOTA (firmware over-the-air) support
Compact: Smallest 2G-4G module on the market
The HL Series is the smallest module on the market sharing a common form factor across 2G, 3G, and 4G technologies. Now, with just one PCB design, device manufacturers can easily integrate voice and data connectivity and deploy in any region, on any wireless mobile network.
Flexible: Solder down or choose the snap-in socket to switch modules any time
The compact form factor offers the choice of soldering down the module for efficient high-volume production or, using a snap-in socket on the same solder pads for total flexibility in prototyping or smaller volume runs. The innovative snap-in socket allows device manufacturers to deploy or change modules at any point in the production and product life cycles.
Future Proof: Intelligent pin-to-pin compatibility to support evolving technologies
The core and extension pins on the common form factor enables forward and backward compatibility between the different 2G, 3G, and 4G module variants. This means that the mechanical pin location delivers the same function across the series. The optional custom pins allow for new features as technology evolves making it the most future proof module on the market.
Upgradeable: Easy to integrate and manage
The HL Series can be managed remotely with AirVantage® Management Service, enabling device manufacturers to securely upgrade device firmware over-the-air. This can extend the life of your products and solutions by future-proofing remote assets, expanding service quality, and saving customers time and operating costs.
Table 2. AirPrime HL7519, HL7548 and HL7588 Features
ABOUT US
TOP offers communication antennas & modules with wonderful solution, Perfect after-sales service, strict quality testing and competitive price.module brands includes Sierra Wiressless, Simcom, Cinterion, U-blox, Hua wei , ZTE, Holux, Globalsat, GlobaTop, Skylab, Telit, etc.
We're also one of the biggest stocking distributors of active and passive electronic components located in Shenzhen.
Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
>10000000
Employee Number:
>20
Ecer Certification：
Verified Supplier
Thank you for your time to know our company and lean our production. TOP Electronic Industry co., Ltd was established in 2006. After 10 years effort and development, now we have become one of the leading electronic components distributors in China. We keep very kind relationship with our su... Thank you for your time to know our company and lean our production. TOP Electronic Industry co., Ltd was established in 2006. After 10 years effort and development, now we have become one of the leading electronic components distributors in China. We keep very kind relationship with our su...
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