Payment Terms | T/T, paypal or western Union |
Supply Ability | 1000pcs per month |
Delivery Time | 3-5 working days after received the payment |
Packaging Details | Packed in original tray firstly ,then carton, at last Bubble bag for outer packing |
Product Name | LTE 4G module |
Chipset | MDM 9230 Qualcomm |
system | Linux and Android |
Temperature Range | -40℃ to 85℃ |
system 2 | Skylight for Windows 7, 8/8.1 |
Applicable Market | North America, Europe |
Brand Name | SIERRA WIRELESS |
Model Number | MC7455 |
Certification | CE, GCF, ROHS |
Place of Origin | Germany |
View Detail Information
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Product Specification
Payment Terms | T/T, paypal or western Union | Supply Ability | 1000pcs per month |
Delivery Time | 3-5 working days after received the payment | Packaging Details | Packed in original tray firstly ,then carton, at last Bubble bag for outer packing |
Product Name | LTE 4G module | Chipset | MDM 9230 Qualcomm |
system | Linux and Android | Temperature Range | -40℃ to 85℃ |
system 2 | Skylight for Windows 7, 8/8.1 | Applicable Market | North America, Europe |
Brand Name | SIERRA WIRELESS | Model Number | MC7455 |
Certification | CE, GCF, ROHS | Place of Origin | Germany |
High Light | wireless communication module ,Sierra Wireless Module |
Qualcomm MDM9230 Chipset 4G Embedded Wireless Modules MC7455 USB 3.0
LTE-FDD,LTE-TDD HSPA+,TD-SCDMA
(B1-B5,,B7,B8,B12,B13,B17,B20,B25,B26,B29,B30,B41)
Main Specifications
Cellular
• FDD/TDD LTE (Cat 6)
1-5,7,8,12,13,17,20,25,26,29,30,41
• Carrier Aggregation
4+17, 2+17, 2+29, 4+5, 17+30, 2+13, 4+13, 4+4,
41+41, 3+20, 7+20, 3+3, 7+7
• DC-HSPA+ (42/5.76 Mbps)
1,2,3,4,5,8
Key Features
• Qualcomm MDM9230 chipset
• Single SKU for North America and Europe
• GNSS
• Dedicated GPS connector with GPS bias or
shared on diversity (TBD)
• GPS, Glonass, Galileo ,BeiDou
• SUPL 1.0, 2.0, XTRA2.0
• Optional support for VoLTE and CSFB voice through
future FW update
• Low power consumption
• Envelope tracking
• Software
• Gobi API, Image switching, MBIM interface
• Basic and Extended AT Commands
• Skylight for Windows 7, 8/8.1
• Linux and Android
Information
Physical Characteristics | |
1 | • Mini card 51 X 30 X 2.75 [mm] |
2 | • USB 3.0 |
3 | • GPIOs for antenna tuning and SAR control |
4 | • PCM/I2S interface for voice (Future FW update) |
Temperature ranges: | |
1 | • –30C to +70C (operating class A) |
2 | • Storage Temperature: –40C to +85C |
Approval & Certification | |
1 | • FCC, CE, PTCRB, GCF |
2 | • Verizon, AT&T, Sprint, Vodafone, Others TBD |
Come into Being:
The new AirPrime modules are based on the Qualcomm® Snapdragon™ X7 LTE Modem, a product of Qualcomm Technologies (QTI), a subsidiary of Qualcomm Incorporated.
LTE-Advanced is designed to improve data rates and performance on LTE networks for both network operators and their customers, As the Internet of Things continues to grow and more devices are added to cellular networks, the additional capacity and throughput that LTE-A offers is essential to providing a good user experience for a variety of mobile computing and M2M communication. We know this is a priority shared by Sierra Wireless, and we’re pleased to continue our longstanding collaboration to bring LTE-A enabled devices to consumers.
Application and Applicable Market:
Designed for mobile computing, networking, and industrial machine-to-machine applications, the new embedded modules are the fourth generation of LTE modules from Sierra Wireless and are offered in two form factors – the AirPrime MC Series (PCI Express Mini Card) and the EM Series (PCI Express M.2) – as well as two variants – the EM7455 and MC7455 for North American and European networks.
Samples of the new modules are available now to select customers for testing and integration. For more samples request, pls contact us any time.
Packing:
module showed on the PCB:
ABOUT US
TOP offers communication antennas & modules with wonderful solution, Perfect after-sales service, strict quality testing and competitive price.module brands includes Sierra Wiressless, Simcom, Cinterion, U-blox, Hua wei , ZTE, Holux, Globalsat, GlobaTop, Skylab, Telit, etc.
We're also one of the biggest stocking distributors of active and passive electronic components located in Shenzhen.
Company Details
Business Type:
Manufacturer
Year Established:
2006
Total Annual:
>10000000
Employee Number:
>20
Ecer Certification:
Verified Supplier
Thank you for your time to know our company and lean our production. TOP Electronic Industry co., Ltd was established in 2006. After 10 years effort and development, now we have become one of the leading electronic components distributors in China. We keep very kind relationship with our su... Thank you for your time to know our company and lean our production. TOP Electronic Industry co., Ltd was established in 2006. After 10 years effort and development, now we have become one of the leading electronic components distributors in China. We keep very kind relationship with our su...
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