Payment Terms | T/T,Western union |
Supply Ability | 1, 000, 000 PCS / week |
Delivery Time | 5-10 days |
Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
Product name | FR4 multilayer pcb |
Size | 16*6cm |
Surface finish | Immersion silver |
Board thickness | 1.6mm |
Brand Name | XCE |
Model Number | XCEM |
Certification | CE,ROHS, FCC,ISO9008,SGS,UL |
Place of Origin | China |
View Detail Information
Explore similar products
200*150mm Green Multi Layered Pcb In Immersion Gold Finished Surface
6 Layer Multilayer PCB Red Solder Mask White Silk Screen For Ultrasonic Wave
Mini Pad 4 Layer Multilayer Pcb Manufacturing Proces Circuit Board With
FR4 Multilayer PCB Lead Free HASL 4 Layer Board 200*108mm SGS
Product Specification
Payment Terms | T/T,Western union | Supply Ability | 1, 000, 000 PCS / week |
Delivery Time | 5-10 days | Packaging Details | inner: vacuum-packed bubble bag outer: carton box |
Product name | FR4 multilayer pcb | Size | 16*6cm |
Surface finish | Immersion silver | Board thickness | 1.6mm |
Brand Name | XCE | Model Number | XCEM |
Certification | CE,ROHS, FCC,ISO9008,SGS,UL | Place of Origin | China |
High Light | multi layered pcb ,multilayer pcb manufacturing |
Printed Circuit Board Multilayer PCB FR4 Material Custom-Made Service
Specification:
Model: XCEM
Origin: China
Min line space: 10mil
Min line width: 10 mil
Board size: 16*6 cm
Layer: 8
Board thickness: 1.2mm
Copper foil: 35UM
Material: FR4
Our Quality:
We are committed to providing the HIGHEST QUALITY PCBs that not only meet but exceed our customers’ expectations and requirements. Our facilities hold a list of quality certifications (IS9001, TS16949, UL) and the systems to support them. For quality control purposes, we have invested extensively in inspection machinery, including:
High-voltage E-test
Flying probe machine
Digital computer metallographic microscope
Copper thickness tester
Solderability detecting machine
Photoelectricity balance
X-ray gold thickness tester
Backlighting tester
Automatic optical inspector
Parameter:
Technology | Capabilities | Capabilities |
Max.Layer Count | 30 Layers | 30 Layers |
Max.Panel Size | 27.5"x24" | 27.5"x24" |
Max.Board Thickness | 3.5mm | 5.8mm |
Outer Layer | 3.5/3.5mils | 3/3mils |
Inner Layer | 3.5/3.5mils | 3/3mils |
Min.Board Thickness | 2L:6mils | 2L:6mils |
| 4L:15mils | 4L:15mils |
| 6L:23mils | 6L:23mils |
Min.SMT/BGA Pitch | 12mils for SMT | 12mils for SMT |
| 24mils for BGA | 20mils for BGA |
Min.Drill Size&Aspect Ratio | 0.2mm Drill for 0.8mm Thickness(4.0:1) | 0.2mm Drill for 0.8mm |
| 0.25mm Drill for 1.6mm | 0.25mm Drill for 1.6mm |
| 0.30mm Drill for 2.4mm | 0.30mm Drill for 2.4mm |
Surface Finishes | HASL | HASL |
| Selective Immersion Tin | Selective Immersion Tin |
| Immersion Silver | Immersion Silver |
| Immersion Gold | Immersion Gold |
| Hard Gold | Hard Gold |
| OSP | OSP |
| Gold finger | Gold finger |
Controlled Impedance | +/- 10% | +/-7% |
Contouring | Routing, V-Groove, | Routing, V-Groove, |
| Beveling Punch | Beveling Punch |
Hole Diameter | +/- 2 mil | +/- 2 mil |
Min.S/M Thickness | 0.4 mil | 0.6 mil |
Company Details
Business Type:
Manufacturer
Year Established:
2002
Total Annual:
1000000-2000000
Employee Number:
100~200
Ecer Certification:
Site Member
Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l... Xinchenger Electronics co.,Ltd established in 2009,we have committed ourselves to manufacturing various of printed circuit boards. We have accumulated abundant experiences in the line of high frequency microwave business for which widely apply to power divider,combiner,power amplifier,l...
Get in touch with us
Leave a Message, we will call you back quickly!