SHANGHAI FAMOUS TRADE CO.,LTD
Products
Manufacturer of a wide range of products which include Microfluidic Laser Equipment For Semiconductor Wafer Processing,High Purity Copper Connection Wire Copper Soft Connection Cables Are Conductive,Copper Heat Sink Substrate Flat...
MOQ: 1
Price: By case
| Payment Terms | T/T |
| Delivery Time | 5-10months |
| Purpose: | Microfluidic laser equipment |
| Countertop volume: | 300*300*150 |
| Positioning accuracy μm: | +/-5 |
| Repeated positioning accuracy μm: | +/-2 |
| Numerical control type: | DPSS Nd:YAG |
| Wavelength: | 532/1064 |
| Brand Name | ZMSH |
| Model Number | Microfluidic laser equipment |
| Certification | rohs |
| Place of Origin | CHINA |
MOQ:
Price: By case
| Payment Terms | T/T |
| Delivery Time | 2-4weeks |
| Products: | High purity copper wire |
| Purity Cu: | 99.999%~99.999999%(5N-8N) |
| Specs range: | 10-200um can be customized upon request |
| Resistivity: | 1.68×10⁻⁸Ω·m (20℃) |
| Thermal conductivity: | 401W/(m·K) |
| Applications: | Power transmission, electronic connection |
| Brand Name | ZMSH |
| Model Number | Copper connection wire |
| Certification | rohs |
| Place of Origin | CHINA |
MOQ:
Price: By case
| Payment Terms | T/T |
| Delivery Time | 2-4weeks |
| Products: | Copper Heat Sink substrate |
| Copper purity: | Cu≥99.9% |
| Type: | Flat Base and Pin-Fin |
| Thermal conductivity: | ≥380W/(m·K) |
| Tensile strength: | 200-350MPa |
| Applications: | Laser diode (LD), 5G RF devices |
| Brand Name | ZMSH |
| Model Number | Copper Heat Sink Substrate |
| Certification | rohs |
| Place of Origin | CHINA |
MOQ:
Price: By case
| Payment Terms | T/T |
| Material composition: | C, O, Si |
| Shore hardness (A) : | 50~55 |
| Elastic recovery coefficient: | 1.28 |
| Upper tolerance temperature: | 260℃ |
| Friction coefficient: | 1.8 |
| PLASMA resistance: | Tolerance |
| Brand Name | ZMSH |
| Model Number | Bionic non-slip pad |
| Certification | rohs |
| Place of Origin | CHINA |
MOQ: 1
Price: By case
| Payment Terms | T/T |
| Delivery Time | 5-10months |
| Purpose: | Microjet laser technology equipment |
| Countertop volume: | 300*300*150 |
| Positioning accuracy μm: | +/-5 |
| Repeated positioning accuracy μm: | +/-2 |
| Numerical control type: | DPSS Nd:YAG |
| Wavelength: | 532/1064 |
| Brand Name | ZMSH |
| Model Number | Microjet laser technology equipment |
| Certification | rohs |
| Place of Origin | CHINA |
MOQ: 1
Price: By case
| Payment Terms | T/T |
| Delivery Time | 5-10months |
| Purpose: | Microjet laser technology equipment |
| Countertop volume: | 300*300*150 |
| Positioning accuracy μm: | +/-5 |
| Repeated positioning accuracy μm: | +/-2 |
| Numerical control type: | DPSS Nd:YAG |
| Wavelength: | 532/1064 |
| Brand Name | ZMSH |
| Model Number | Microjet laser technology equipment |
| Certification | rohs |
| Place of Origin | CHINA |
MOQ: 2
Price: By case
| Payment Terms | T/T |
| Delivery Time | 5-10months |
| Bonding Methods: | Room Temperature Bonding |
| Compatible Wafer Sizes: | ≤12 Inch, Compatible With Irregular Shaped Samples |
| Compatible Materials: | Sapphire, InP, SiC, GaAs, GaN, Diamond, Glass, Etc |
| Max Pressure Of Press System: | 100 KN |
| Alignment Method & Precision: | Edge alignment accuracy: ≤±50 μm; Mark alignment accuracy: ≤±2 μm |
| Bonding Strength: | ≥2.0 J/m² @ room temperature (for Si-Si direct bonding) |
| Brand Name | ZMSH |
| Model Number | Wafer Bonding Equipment |
| Certification | rohs |
| Place of Origin | CHINA |
MOQ: 2
Price: By case
| Payment Terms | T/T |
| Delivery Time | 5-10months |
| Compatible Wafer Sizes: | 4 -12inch |
| Compatible Materials: | Si wafer, SiC wafer, SiC ingot |
| Axis orientation: | z-axis |
| Minimum resolution: | 0.1um/s |
| Principal axis: | Water-cooling system |
| Brand Name | ZMSH |
| Model Number | Wafer Precision Thinning Equipment |
| Certification | rohs |
| Place of Origin | CHINA |
MOQ: 2
Price: By case
| Payment Terms | T/T |
| Delivery Time | 5-10months |
| Bonding Methods: | Thermal Pressure Bonding |
| Compatible Wafer Sizes: | 2-8inch |
| Compatible Materials: | Si, Cu, Au, Au-Sn,Al-Ge |
| Maximum temperature: | 600℃ |
| Maximum pressing force: | 100kN, control accuracy ≤±1% |
| Anode voltage and current: | ≤2kv, ≤100mA |
| Brand Name | ZMSH |
| Model Number | Thermo Compression Anodic Bonding Equipment |
| Certification | rohs |
| Place of Origin | CHINA |
MOQ: 1
Price: By case
| Payment Terms | T/T |
| Temperature range: | 1300℃ |
| Heating rate: | Up to 100°C/ s |
| Degree of automation: | Fully automatic control system |
| Application: | SIC,GaN and other third generation semiconductor field |
| Brand Name | ZMSH |
| Model Number | Automatic double cavity fast annealing furnace |
| Certification | rohs |
| Place of Origin | CHINA |
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