SHANGHAI FAMOUS TRADE CO.,LTD
| Payment Terms | T/T |
| Delivery Time | 2-4weeks |
| Products: | Copper Heat Sink substrate |
| Copper purity: | Cu≥99.9% |
| Type: | Flat Base and Pin-Fin |
| Thermal conductivity: | ≥380W/(m·K) |
| Tensile strength: | 200-350MPa |
| Applications: | Laser diode (LD), 5G RF devices |
| Brand Name | ZMSH |
| Model Number | Copper Heat Sink Substrate |
| Certification | rohs |
| Place of Origin | CHINA |
View Detail Information
Explore similar products
Black Indium Phosphide Wafer , Semiconductor Wafer For LD Application
Primary / Dummy Grade Indium Phosphide Wafer Thickness 350um For LD
GaSb
4 Inch Semi-Insulating Indium Phosphide InP Wafer For LD Laser Diode
Product Specification
| Payment Terms | T/T | Delivery Time | 2-4weeks |
| Products: | Copper Heat Sink substrate | Copper purity: | Cu≥99.9% |
| Type: | Flat Base and Pin-Fin | Thermal conductivity: | ≥380W/(m·K) |
| Tensile strength: | 200-350MPa | Applications: | Laser diode (LD), 5G RF devices |
| Brand Name | ZMSH | Model Number | Copper Heat Sink Substrate |
| Certification | rohs | Place of Origin | CHINA |
Copper Heat Sink Substrate is a heat dissipating element made of high thermal conductivity pure copper (Cu≥99.9%) or copper alloy (such as C1100, C1020) as the core material through precision machining (CNC cutting, stamping, welding, etc.). Mainly used for thermal management of high power electronic devices (such as LED, IGBT, CPU). According to the structure, it can be divided into Flat Base and Pin-Fin, which are designed for different heat dissipation requirements.
With its ultra-high thermal conductivity and customizable construction, copper cooling substrates are the core components for high power electronic cooling. The flat-bottom model is suitable for compact thermal conductivity needs, while the pin model is optimized for forced convection heat dissipation, and together they cover thermal management scenarios from consumer electronics to industrial scale.
| Characteristic | Flat Base | Pin type (PIN-FIN) |
| Structure | Flat surface, uniform thickness | Dense fins (height 5-50mm, spacing 1-5mm) |
| Heat dissipation mode | Conductor-based (contact heat conduction) | Convection dominated (increased surface area) |
| Application scenario | Direct chip mounting (e.g. LED, IC) | Forced air/liquid cooling systems (e.g. CPU heat sink) |
| Processing cost | Lower (CNC cutting or stamping) | High (to be welded or extruded) |
| Typical thermal resistance | 0.1-0.5℃/W (@1mm thickness) | 0.05-0.2℃/W (with fan) |
(1) Thermal conductivity
· Thermal conductivity ≥380W/(m·K), much higher than aluminum (~200W/(m·K)), suitable for high heat density scenarios.
· The surface can be nickel-plated (Ni) or anti-oxidation treatment to prevent copper oxidation leading to thermal resistance rise.
(2) Mechanical properties
· Tensile strength 200-350MPa, can be processed into a thin 0.3mm soaking plate.
· High temperature resistance (long-term operating temperature ≤200℃), suitable for high-power devices.
(3) Structural design
· Flat bottom type: flat contact surface, suitable for direct fitting with the chip (such as LED COB package).
· Pin type: Dense Fin (Pin-fin) structure, which increases the heat transfer efficiency by increasing the surface area.
(4) Surface treatment
· Optional electroless nickel plating (ENIG), sandblasting or antioxidant coating to meet different environmental requirements.
(1) Power electronic heat dissipation
· LED lighting: Metal substrate (such as MCPCB) for high-power LED modules to reduce junction temperature (Tj).
· IGBT module: copper-based radiator for electric vehicle inverters, resistant to high temperature and humidity.
· Server CPU/GPU: High thermal conductivity copper base + heat pipe heat dissipation solution.
(2) Optoelectronics and communication
· Laser diode (LD) : Copper tungsten (Cu-W) composite substrate to solve the problem of thermal expansion coefficient (CTE) matching.
· 5G RF devices: Local heat dissipation enhancement of high-frequency PA modules.
(3) Industrial and automotive electronics
· Power module: Soaking plate design of DC-DC converter.
· Battery Management System (BMS) : Copper cooling substrate for fast charging pile.
1. Q: What is a copper heat sink substrate used for?
A: It efficiently dissipates heat in high-power electronics like LEDs, CPUs, and IGBT modules due to copper's superior thermal conductivity.
2. Q: What is the difference between flat and pin-fin copper heat sinks?
A: Flat bases excel in direct conduction cooling, while pin-fin designs boost airflow for forced convection systems.
Tag: #High purity, #Copper Heat Sink Substrate, #Flat bottom type, #Pin type, #High power electronic device, #Cu≥99.9%
Company Details
Business Type:
Manufacturer,Agent,Importer,Exporter,Trading Company
Year Established:
2013
Total Annual:
1000000-1500000
Ecer Certification：
Verified Supplier
SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components wi... SHANGHAI FAMOUS TRADE CO.,LTD. locates in the city of Shanghai, Which is the best city of China, and our factory is founded in Wuxi city in 2014. We specialize in processing a varity of materials into wafers, substrates and custiomized optical glass parts.components wi...
Get in touch with us
Leave a Message, we will call you back quickly!