TONGZHAN INDUSTRIAL LIMITED
Products
Manufacturer of a wide range of products which include Carbon Ink Printed Circuit Board Fabrication Rogers Turnkey Pcb Electronics,Automotive Electronics Turnkey PCB Assembly Consumer Electronics Circuit Board,Custom Printed Circu...
MOQ: Negotiable
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 100000pc/Month |
| Delivery Time | 4 Weeks |
| Packaging Details | PCB + Box |
| Keyword | Turnkey PCB Assembly |
| Materials | High-Tg FR4, Rogers, Nelco, RCC, PTFE |
| PCB boards | FPC boards, Rigid-flex boards, Metal base boards |
| Applications | Electronics Device, Consumer Electronics, Electronical products, PCBA Circuit Board, Industrial Control |
| Surface Finished | HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP |
| Thickness | 0.3-6.5mm |
| Min Laser Hole | 0.075mm |
| Copper Thickness | 0.3-12 oz |
| Payment Method | T/T |
| Whether to Support customization | Support |
| Logistics | Accept customer specified logistics |
| Place of Origin | China |
| Brand Name | CUSTOM MADE |
| Certification | ISO/UL |
MOQ: Negotiable
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 100000pc/Month |
| Delivery Time | 4 Weeks |
| Packaging Details | PCB + Box |
| Keyword | Turnkey PCB Assembly |
| Applications | Industrial Control, Medical, Automotive Electronics |
| Materials | High-Tg FR4, Rogers, Nelco, RCC, PTFE, FR4 |
| PCB boards | POP Board, Ordinary Board, FPC Board, Rigid-Flex Board, Metal Substrate Boards |
| Service | One-stop Service for PCB and SMT Assembly |
| Min Outline Tolerance | ±0.1mm |
| Surface Finished | HASL Pb Free Immersion Gold/Tin/Silver Osp |
| Max Board Size | 650mm*1130mm |
| Payment Method | T/T |
| Whether to Support customization | Support |
| Logistics | Accept customer specified logistics |
| Place of Origin | China |
| Brand Name | CUSTOM MADE |
| Certification | ISO/UL |
MOQ: Negotiable
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 100000pc/Month |
| Delivery Time | 4 weeks |
| Packaging Details | PCB + Box |
| Keyword | Printed Circuit Board Fabrication |
| Insulation | FR4 board, aluminum substrate, copper substrate, ceramic substrate, PI (polycumimine), PET (poly) |
| Copper foil material | Glue-free calendered copper, rubber-rolled copper, glue-based electrolytic copper |
| number | 1-12 floors |
| The finished board is thick | 0.07MM AND ABOVE (TOLERANCE +5%) |
| The inner layer is thick copper | 18-7OUM (1 ounce copper = 35UM) |
| The outer layer is thick copper | 20-14OUM (1 plate copper = 35UM) |
| Solder mask | Red oil, green oil, butter, blue oil, white oil, black oil, matte black oil, yellow film covered white film, black film |
| word | Red, green, yellow, blue, white, black silver |
| Surface treatment | Anti-oxidation (OSP), tin spraying, gold immersion, gold plating, silver plating nickel plating, gold plating finger, carbon oil |
| Special processes | Thick copper plate, impedance plate, high frequency plate, half-hole plate, orifice plate, hollow plate, single-layer copper foil, cross-sided gold finger plate, soft and hard combination |
| Reinforcement type | PI, FR4, steel sheet, 3M glue, electromagnetic shielding film |
| Maximum size | 50OMM*1000MM |
| Outer line width/line spacing | 0.065MM( 3MIL) |
| Inner line width/line spacing | 0.065MM(3MIL) |
| Minimum solder mask width | 0.10MM |
| Minimum mask bridge width | 0.05MM |
| Minimum solder mask | 0.45MM |
| Minimum aperture | MECHANICAL DRILLING 0.2MM, LASER DRILLING 0,1MM |
| Impedance tolerance | 10% of soil |
| Form tolerances | +0.05MM(LASER+0.005MM) |
| Molding method | V-cut, CNC, die punching, laser |
| Brand Name | CUSTOM MADE |
| Certification | ISO/UL |
| Place of Origin | China |
MOQ: Negotiable
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 100000pc/Month |
| Delivery Time | 4 weeks |
| Packaging Details | PCB + Box |
| Keyword | Printed Circuit Board Fabrication |
| Insulation | FR4 board, aluminum substrate, copper substrate, ceramic substrate, PI (polycumimine), PET (poly) |
| Copper foil material | Glue-free calendered copper, rubber-rolled copper, glue-based electrolytic copper |
| number | 1-12 floors |
| The finished board is thick | 0.07MM AND ABOVE (TOLERANCE +5%) |
| The inner layer is thick copper | 18-7OUM (1 ounce copper = 35UM) |
| The outer layer is thick copper | 20-14OUM (1 plate copper = 35UM) |
| Solder mask | Red oil, green oil, butter, blue oil, white oil, black oil, matte black oil, yellow film covered white film, black film |
| word | Red, green, yellow, blue, white, black silver |
| Surface treatment | Anti-oxidation (OSP), tin spraying, gold immersion, gold plating, silver plating nickel plating, gold plating finger, carbon oil |
| Special processes | Thick copper plate, impedance plate, high frequency plate, half-hole plate, orifice plate, hollow plate, single-layer copper foil, cross-sided gold finger plate, soft and hard combination |
| Reinforcement type | PI, FR4, steel sheet, 3M glue, electromagnetic shielding film |
| Maximum size | 50OMM*1000MM |
| Outer line width/line spacing | 0.065MM( 3MIL) |
| Inner line width/line spacing | 0.065MM(3MIL) |
| Minimum solder mask width | 0.10MM |
| Minimum mask bridge width | 0.05MM |
| Minimum solder mask | 0.45MM |
| Minimum aperture | MECHANICAL DRILLING 0.2MM, LASER DRILLING 0,1MM |
| Impedance tolerance | 10% of soil |
| Form tolerances | +0.05MM(LASER+0.005MM) |
| Molding method | V-cut, CNC, die punching, laser |
| Brand Name | CUSTOM MADE |
| Certification | ISO/UL |
| Place of Origin | China |
MOQ: Negotiable
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 100000pc/Month |
| Delivery Time | 4 weeks |
| Packaging Details | PCB + Box |
| Keyword | Printed Circuit Board Fabrication |
| Insulation | FR4 board, aluminum substrate, copper substrate, ceramic substrate, PI (polycumimine), PET (poly) |
| Copper foil material | Glue-free calendered copper, rubber-rolled copper, glue-based electrolytic copper |
| number | 1-12 floors |
| The finished board is thick | 0.07MM AND ABOVE (TOLERANCE +5%) |
| The inner layer is thick copper | 18-7OUM (1 ounce copper = 35UM) |
| The outer layer is thick copper | 20-14OUM (1 plate copper = 35UM) |
| Solder mask | Red oil, green oil, butter, blue oil, white oil, black oil, matte black oil, yellow film covered white film, black film |
| word | Red, green, yellow, blue, white, black silver |
| Surface treatment | Anti-oxidation (OSP), tin spraying, gold immersion, gold plating, silver plating nickel plating, gold plating finger, carbon oil |
| Special processes | Thick copper plate, impedance plate, high frequency plate, half-hole plate, orifice plate, hollow plate, single-layer copper foil, cross-sided gold finger plate, soft and hard combination |
| Reinforcement type | PI, FR4, steel sheet, 3M glue, electromagnetic shielding film |
| Maximum size | 50OMM*1000MM |
| Outer line width/line spacing | 0.065MM( 3MIL) |
| Inner line width/line spacing | 0.065MM(3MIL) |
| Minimum solder mask width | 0.10MM |
| Minimum mask bridge width | 0.05MM |
| Minimum solder mask | 0.45MM |
| Minimum aperture | MECHANICAL DRILLING 0.2MM, LASER DRILLING 0,1MM |
| Impedance tolerance | 10% of soil |
| Form tolerances | +0.05MM(LASER+0.005MM) |
| Molding method | V-cut, CNC, die punching, laser |
| Brand Name | CUSTOM MADE |
| Certification | ISO/UL |
| Place of Origin | China |
MOQ: Negotiable
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 100000pc/Month |
| Delivery Time | 4 weeks |
| Packaging Details | PCB + Box |
| Keyword | Printed Circuit Board Fabrication |
| Insulation | FR4 board, aluminum substrate, copper substrate, ceramic substrate, PI (polycumimine), PET (poly) |
| Copper foil material | Glue-free calendered copper, rubber-rolled copper, glue-based electrolytic copper |
| number | 1-12 floors |
| The finished board is thick | 0.07MM AND ABOVE (TOLERANCE +5%) |
| The inner layer is thick copper | 18-7OUM (1 ounce copper = 35UM) |
| The outer layer is thick copper | 20-14OUM (1 plate copper = 35UM) |
| Solder mask | Red oil, green oil, butter, blue oil, white oil, black oil, matte black oil, yellow film covered white film, black film |
| word | Red, green, yellow, blue, white, black silver |
| Surface treatment | Anti-oxidation (OSP), tin spraying, gold immersion, gold plating, silver plating nickel plating, gold plating finger, carbon oil |
| Special processes | Thick copper plate, impedance plate, high frequency plate, half-hole plate, orifice plate, hollow plate, single-layer copper foil, cross-sided gold finger plate, soft and hard combination |
| Reinforcement type | PI, FR4, steel sheet, 3M glue, electromagnetic shielding film |
| Maximum size | 50OMM*1000MM |
| Outer line width/line spacing | 0.065MM( 3MIL) |
| Inner line width/line spacing | 0.065MM(3MIL) |
| Minimum solder mask width | 0.10MM |
| Minimum mask bridge width | 0.05MM |
| Minimum solder mask | 0.45MM |
| Minimum aperture | MECHANICAL DRILLING 0.2MM, LASER DRILLING 0,1MM |
| Impedance tolerance | 10% of soil |
| Form tolerances | +0.05MM(LASER+0.005MM) |
| Molding method | V-cut, CNC, die punching, laser |
| Brand Name | CUSTOM MADE |
| Certification | ISO/UL |
| Place of Origin | China |
MOQ: Negotiable
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 100000pc/Month |
| Delivery Time | 4 weeks |
| Packaging Details | PCB + Box |
| Keyword | Printed Circuit Board Fabrication |
| Insulation | FR4 board, aluminum substrate, copper substrate, ceramic substrate, PI (polycumimine), PET (poly) |
| Copper foil material | Glue-free calendered copper, rubber-rolled copper, glue-based electrolytic copper |
| number | 1-12 floors |
| The finished board is thick | 0.07MM AND ABOVE (TOLERANCE +5%) |
| The inner layer is thick copper | 18-7OUM (1 ounce copper = 35UM) |
| The outer layer is thick copper | 20-14OUM (1 plate copper = 35UM) |
| Solder mask | Red oil, green oil, butter, blue oil, white oil, black oil, matte black oil, yellow film covered white film, black film |
| word | Red, green, yellow, blue, white, black silver |
| Surface treatment | Anti-oxidation (OSP), tin spraying, gold immersion, gold plating, silver plating nickel plating, gold plating finger, carbon oil |
| Special processes | Thick copper plate, impedance plate, high frequency plate, half-hole plate, orifice plate, hollow plate, single-layer copper foil, cross-sided gold finger plate, soft and hard combination |
| Reinforcement type | PI, FR4, steel sheet, 3M glue, electromagnetic shielding film |
| Maximum size | 50OMM*1000MM |
| Outer line width/line spacing | 0.065MM( 3MIL) |
| Inner line width/line spacing | 0.065MM(3MIL) |
| Minimum solder mask width | 0.10MM |
| Minimum mask bridge width | 0.05MM |
| Minimum solder mask | 0.45MM |
| Minimum aperture | MECHANICAL DRILLING 0.2MM, LASER DRILLING 0,1MM |
| Impedance tolerance | 10% of soil |
| Form tolerances | +0.05MM(LASER+0.005MM) |
| Molding method | V-cut, CNC, die punching, laser |
| Brand Name | CUSTOM MADE |
| Certification | ISO/UL |
| Place of Origin | China |
MOQ: Negotiable
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 100000pc/Month |
| Delivery Time | 4 weeks |
| Packaging Details | PCB + Box |
| Keyword | Printed Circuit Board Fabrication |
| Insulation | FR4 board, aluminum substrate, copper substrate, ceramic substrate, PI (polycumimine), PET (poly) |
| Copper foil material | Glue-free calendered copper, rubber-rolled copper, glue-based electrolytic copper |
| number | 1-12 floors |
| The finished board is thick | 0.07MM AND ABOVE (TOLERANCE +5%) |
| The inner layer is thick copper | 18-7OUM (1 ounce copper = 35UM) |
| The outer layer is thick copper | 20-14OUM (1 plate copper = 35UM) |
| Solder mask | Red oil, green oil, butter, blue oil, white oil, black oil, matte black oil, yellow film covered white film, black film |
| word | Red, green, yellow, blue, white, black silver |
| Surface treatment | Anti-oxidation (OSP), tin spraying, gold immersion, gold plating, silver plating nickel plating, gold plating finger, carbon oil |
| Special processes | Thick copper plate, impedance plate, high frequency plate, half-hole plate, orifice plate, hollow plate, single-layer copper foil, cross-sided gold finger plate, soft and hard combination |
| Reinforcement type | PI, FR4, steel sheet, 3M glue, electromagnetic shielding film |
| Maximum size | 50OMM*1000MM |
| Outer line width/line spacing | 0.065MM( 3MIL) |
| Inner line width/line spacing | 0.065MM(3MIL) |
| Minimum solder mask width | 0.10MM |
| Minimum mask bridge width | 0.05MM |
| Minimum solder mask | 0.45MM |
| Minimum aperture | MECHANICAL DRILLING 0.2MM, LASER DRILLING 0,1MM |
| Impedance tolerance | 10% of soil |
| Form tolerances | +0.05MM(LASER+0.005MM) |
| Molding method | V-cut, CNC, die punching, laser |
| Brand Name | CUSTOM MADE |
| Certification | ISO/UL |
| Place of Origin | China |
MOQ: Negotiable
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 100000pc/Month |
| Delivery Time | 4 weeks |
| Packaging Details | PCB + Box |
| Keyword | Printed Circuit Board Fabrication |
| Insulation | FR4 board, aluminum substrate, copper substrate, ceramic substrate, PI (polycumimine), PET (poly) |
| Copper foil material | Glue-free calendered copper, rubber-rolled copper, glue-based electrolytic copper |
| number | 1-12 floors |
| The finished board is thick | 0.07MM AND ABOVE (TOLERANCE +5%) |
| The inner layer is thick copper | 18-7OUM (1 ounce copper = 35UM) |
| The outer layer is thick copper | 20-14OUM (1 plate copper = 35UM) |
| Solder mask | Red oil, green oil, butter, blue oil, white oil, black oil, matte black oil, yellow film covered white film, black film |
| word | Red, green, yellow, blue, white, black silver |
| Surface treatment | Anti-oxidation (OSP), tin spraying, gold immersion, gold plating, silver plating nickel plating, gold plating finger, carbon oil |
| Special processes | Thick copper plate, impedance plate, high frequency plate, half-hole plate, orifice plate, hollow plate, single-layer copper foil, cross-sided gold finger plate, soft and hard combination |
| Reinforcement type | PI, FR4, steel sheet, 3M glue, electromagnetic shielding film |
| Maximum size | 50OMM*1000MM |
| Outer line width/line spacing | 0.065MM( 3MIL) |
| Inner line width/line spacing | 0.065MM(3MIL) |
| Minimum solder mask width | 0.10MM |
| Minimum mask bridge width | 0.05MM |
| Minimum solder mask | 0.45MM |
| Minimum aperture | MECHANICAL DRILLING 0.2MM, LASER DRILLING 0,1MM |
| Impedance tolerance | 10% of soil |
| Form tolerances | +0.05MM(LASER+0.005MM) |
| Molding method | V-cut, CNC, die punching, laser |
| Brand Name | CUSTOM MADE |
| Certification | ISO/UL |
| Place of Origin | China |
MOQ: Negotiable
Price: Negotiable
| Payment Terms | T/T |
| Supply Ability | 100000pc/Month |
| Delivery Time | 4 weeks |
| Packaging Details | PCB + Box |
| Keyword | Printed Circuit Board Fabrication |
| Insulation | FR4 board, aluminum substrate, copper substrate, ceramic substrate, PI (polycumimine), PET (poly) |
| Copper foil material | Glue-free calendered copper, rubber-rolled copper, glue-based electrolytic copper |
| number | 1-12 floors |
| The finished board is thick | 0.07MM AND ABOVE (TOLERANCE +5%) |
| The inner layer is thick copper | 18-7OUM (1 ounce copper = 35UM) |
| The outer layer is thick copper | 20-14OUM (1 plate copper = 35UM) |
| Solder mask | Red oil, green oil, butter, blue oil, white oil, black oil, matte black oil, yellow film covered white film, black film |
| word | Red, green, yellow, blue, white, black silver |
| Surface treatment | Anti-oxidation (OSP), tin spraying, gold immersion, gold plating, silver plating nickel plating, gold plating finger, carbon oil |
| Special processes | Thick copper plate, impedance plate, high frequency plate, half-hole plate, orifice plate, hollow plate, single-layer copper foil, cross-sided gold finger plate, soft and hard combination |
| Reinforcement type | PI, FR4, steel sheet, 3M glue, electromagnetic shielding film |
| Maximum size | 50OMM*1000MM |
| Outer line width/line spacing | 0.065MM( 3MIL) |
| Inner line width/line spacing | 0.065MM(3MIL) |
| Minimum solder mask width | 0.10MM |
| Minimum mask bridge width | 0.05MM |
| Minimum solder mask | 0.45MM |
| Minimum aperture | MECHANICAL DRILLING 0.2MM, LASER DRILLING 0,1MM |
| Impedance tolerance | 10% of soil |
| Form tolerances | +0.05MM(LASER+0.005MM) |
| Molding method | V-cut, CNC, die punching, laser |
| Brand Name | CUSTOM MADE |
| Certification | ISO/UL |
| Place of Origin | China |
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