M6 TU862 TU872 PCB Manufacturing 0.3-12 oz Copper Thickness

Product Specification

Advanced PCB Manufacturing: Diverse Materials and Precision Processes

PCB Manufacturing Introduction:
Experience the forefront of PCB manufacturing with our comprehensive solutions. From FR4 to aluminum, copper to ceramic substrates, we offer a range of insulation materials. Choose from glueless rolled copper, glued rolled copper, or glued electrolytic copper for your copper foil needs. With 1 to 12 layers, our boards provide exceptional versatility.

Our finished plate thickness starts at 0.07mm, with a tolerance of +5%/-6%. Inner layer copper thickness ranges from 18-70μm, and outer layer copper thickness spans from 20-140μm, ensuring optimal conductivity. Select from a variety of solder-resist colors and lettering options, along with advanced surface treatments like anti-oxidation, HASL, immersion gold, and more.

Unlock innovation with specialized processes, including thick copper plating, impedance control, and single-layer copper foil gold finger plates. Choose reinforcements like Pl, FR4, steel sheet, M glue, or electromagnetic shielding film. Our boards can be designed up to 500mm x 1000mm in size, maintaining precision with outer/inner line width and spacing of 0.065mm/3mil.

Ensure reliability with minimum solder resist ring width, solder bridge width, solder mask window, and aperture requirements. Our products maintain impedance tolerance at 10% and adhere to shape tolerances of +0.05mm G laser +0.005mm. Forming methods like V-cut, CNC, and punching cater to various fabrication needs.

Join us in shaping the future of electronics with these precise, versatile, and dynamic PCB offerings.

PCB Manufacturing Parameters:

PCB Manufacturing Process:

1. Gold-plating process: the vertical HASL process is very difficult to flatten very thin pads, which brings difficulty to SMT placement. In addition, the shelf life of the HASL is very short, and gold-plating just solves the problem. these problems.

2. Immersion gold process: The purpose of the immersion gold process is to deposit a nickel-gold coating with stable color, good brightness, flat coating and good solderability on the surface of the printed circuit board. Basically, it can be divided into four stages: pre-treatment (oil extraction, micro-etching, activation, post-immersion), nickel immersion, gold immersion, and post-treatment (waste gold washing, DI washing, drying)

3. Leaded HASL: Leaded eutectic temperature is lower than lead-free, the specific amount depends on the composition of the lead-free alloy, such as the total gold of SNAGCU 217 degrees, the soldering temperature is the eutectic immersion plus 30 degrees or 50 degrees, It depends on the actual adjustment, the lead eutectic is 183 degrees, the mechanical strength, brightness, etc. are better than lead-free.

4. Lead-free HASL: lead will increase the activity of tin wire in the soldering process, lead-tin wire is better than lead-free tin wire, but lead is poisonous, long-term use is not good for human health, and lead-free tin will It is brighter than lead-tin melting, so the solder joint is much stronger.

5. SOP (anti-oxidation): It has anti-oxidation, thermal shock resistance, and corrosion resistance. It is used to protect the copper surface from rusting (oxidation or carbonization) in a normal environment: but in the subsequent welding high temperature, this protection The film must be easily removed quickly by the flux so that the exposed clean copper surface can be melted and soldered immediately in a short time to become a firm solder joint.

PCB Manufacturing Advantages:

1. From PCB proofing to SMT placement, one-stop solution, reducing R&D costs and accelerating product launch.

2. Quick quotation and quick response.

3. The delivery date is fast, and the on-time delivery rate is over 95%

4. Excellent materials, advanced equipment, and strict quality system 5. Exclusive customer service one-to-one service, seamless connection throughout the process