Witgain Technology Limited
| Payment Terms | T/T |
| Supply Ability | 50k pcs/month |
| Delivery Time | 30 days |
| Packaging Details | Vacuum bubble bag packaging |
| No of layers: | 20 layers |
| Solder mask colour: | Green |
| Material: | FR4 TG>170 |
| Place of Origin: | ShenZhen China |
| Surface technics: | ENIG 3U' |
| Min Lind Space&Width: | 2.5/2.5mil |
| Brand Name | WITGAIN PCB |
| Model Number | Multi-Layer PCB0024 |
| Certification | UL |
| Place of Origin | China |
View Detail Information
Explore similar products
4 Layer Printed MultiLayer Circuit Board Blue Solder Mask 18um PTH Thick
Immersion Gold Multi Layer PCB Board 8 Layer FR4 TG Material
Red Solder MultiLayer Circuit Board UL 6 Layer Printed Circuit Board 0.3MM Hole
8 Layer Multilayer Circuit Board Red Solder Printed 50 Ohm
Product Specification
| Payment Terms | T/T | Supply Ability | 50k pcs/month |
| Delivery Time | 30 days | Packaging Details | Vacuum bubble bag packaging |
| No of layers: | 20 layers | Solder mask colour: | Green |
| Material: | FR4 TG>170 | Place of Origin: | ShenZhen China |
| Surface technics: | ENIG 3U' | Min Lind Space&Width: | 2.5/2.5mil |
| Brand Name | WITGAIN PCB | Model Number | Multi-Layer PCB0024 |
| Certification | UL | Place of Origin | China |
| High Light | 2.5Mil Multilayer Circuit Board ，FR4 Multilayer Circuit Board ，OEM 20 Layer PCB | ||
Multilayer Circuit Board 20 Layer PCB FR4 Material 2.5/2.5Mil Lind Space&Width
PCB Specifications:
1 Part NO: Multi-Layer PCB0024
2 Layer Count: 20 Layer PCB
3 Finished Board Thickness: 2.4MM
4 Copper Thickness: 1/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H1
5 Min Lind Space&Width: 2.5/2.5mil
6 Application Area: Consumer Porducts
| IR No : QCR Reference : Date: | ||||||
| PCB DESCRIPTION | ||||||
| C-dot Part Number of PCB | ||||||
| Name of the PCB | ||||||
| No of Layers : | 20 | Density Classification : E | ||||
| PCB Size: | Length | Breadth | Unit | Thickness | ||
| 280 | X | 322.25 | mm | 2.4 mm | ||
| Panel Size: | 290 X 322.25 mm 2.4 mm | |||||
| Number of PCBs per Panel : | 1 | |||||
| DESIGN & DRILL DATA | ||||||
| Input type : | Gerber Files | Qty 27 | ||||
| Input Code : | ASCII | |||||
| Number Format : | 2.4 | |||||
| Units : | Inches | |||||
| Zero Omit : | Trailing | |||||
| Coordinates: | Absolute | |||||
| Scale : | 1:1 | |||||
| DRC CHECKS FOR SIGNAL LAYERS | ||||||
| Minimum Track width : | Inner Layer 3.75 mils | Outer Layer 5 mils | ||||
| Minimum Spacing between Tracks : | Inner Layer 5 mils | Outer Layer 5 mils | ||||
| Minimum Spacing between Pad & Track: | Inner Layer 4 mils | Outer Layer 5 mils | ||||
| Minimum PTH Size: | 10 mils | |||||
| Minimum Annular Ring: | 4 mils | |||||
| Minimum SMD Pitch: | 19.685 mils | |||||
| FILM & GERBER DETAILS | ||||||
| Description | Films | File Name | Description | Films | File Name | |
| Drill | DRL | ABC00DRL.GBX | Etch Layer 17 | L17 | ABC00L17.GBX | |
| Solder Paste Top | SPT | ABC00SPT.GBX | Etch Layer 18 | L18 | ABC00L18.GBX | |
| Legend Top | LGT | ABC00LGT.GBX | Etch Layer 19 | L19 | ABC00L19.GBX | |
| Solder Mask Top | SMT | ABC00SMT.GBX | Etch Layer 20 | L20 | ABC00L20.GBX | |
| Etch Layer 1 | L01 | ABC00L01.GBX | Etch Layer 21 | L21.GBX | ||
| Etch Layer 2 | L02 | ABC00L02.GBX | Etch Layer 22 | L22.GBX | ||
| Etch Layer 3 | L03 | ABC00L03.GBX | Etch Layer 23 | L23.GBX | ||
| Etch Layer 4 | L04 | ABC00L04.GBX | Etch Layer 24 | L24.GBX | ||
| Etch Layer 5 | L05 | ABC00L05.GBX | Etch Layer 25 | L25.GBX | ||
| Etch Layer 6 | L06 | ABC00L06.GBX | Etch Layer 26 | L26.GBX | ||
| Etch Layer 7 | L07 | ABC00L07.GBX | Etch Layer 27 | L27.GBX | ||
| Etch Layer 8 | L08 | ABC00L08.GBX | Etch Layer 28 | L28.GBX | ||
| Etch Layer 9 | L09 | ABC00L09.GBX | Etch Layer 29 | L29.GBX | ||
| Etch Layer 10 | L10 | ABC00L10.GBX | Etch Layer 30 | L30.GBX | ||
| Etch Layer 11 | L11 | ABC00L11.GBX | Solder Mask Bottom | SMB | ABC00SMB.GBX | |
| Etch Layer 12 | L12 | ABC00L12.GBX | Legend Bottom | LGB | ABC00LGB.GBX | |
| Etch Layer 13 | L13 | ABC00L13.GBX | Solder Paste Bottom | SPB | ABC00SPB.GBX | |
| Etch Layer 14 | L14 | ABC00L14.GBX | NC Drill | NCD | ABC00_NCD.TAP | |
| Etch Layer 15 | L15 | ABC00L15.GBX | NC Drill Tool Set | NCT | ABC00NCT.TXT | |
| Etch Layer 16 | L16 | ABC00L16.GBX | Decode List | DCL.TXT | ||
| MANUFACTURING DETAILS | |
| Solder Mask Type : | Photo Imageable |
| Minimum Solder Mask Clearance : | 2.5 mils |
| Legend On (Side) : | Both |
| Design Technology | Mixed |
| Special Requirements : | |
|
Controlled Impedance : Yes Back dril from Bottom : 7 Layers / Files Back drill pin count : 156 pins |
|
| BGA Used | |
| Base Material | FR408HR |
| If base material is other than FR4 please provide complete details of the material: |
|
| Surface Finish | Electroless gold over nickel (ENIG) |
| Gold Plating required for Edge fingers No of Edge Fingers/Total Area (Specify , if the option is 'yes') |
No |
| Nos/ Sq Inches | |
| Automatic Copper Balancing Allowed | Yes |
| Tear Drop | Triangular to be added by the fabricator |
| Constructional Details Drawing No | Layer stackup |
| MISCELLANEOUS DETAILS | |
|
The PCB 1. Has vias on pads filled with epoxy and plated with planner.2. Has back-drill vias filled with epoxy 3. Has ENIG surface finish. 4. Five Back drill NCD files attached 5. Depanalizing pcb by slot cut. Back drill layers: 1.Bottom to Layer19, 2.Bottom to Layer17, 3.Bottom to Layer15, 4.Bottom to Layer10, 5.Bottom to Layer08, 6.Bottom to Layer06, 7.Bottom to Layer04. |
|
| APPROVALS | |
| Designer Name | Approved by |
Layer Stackup:
| Layer No. | Layer Type | Di-electric (Prepreg/ Core) |
Di-electric constant |
Processed Thickness (mil) |
Target Impedance - Single Ended (+/- 10%) |
Trace Width (Single ended) (mil) |
Target Impedance – differential (+/- 10%) |
Trace Width/ separation (differential pair) (mil) |
| MASK | 4.0 | 2.0 | ||||||
| 1 | TOP |
Copper Foil 12 microns
|
1.772 |
50 ohm 55 ohm |
7 6 |
100ohm 95ohm 90ohm |
5-8-5 5-6.5-5 5-5.5-5 |
|
| PrepreG | 3.23 | 2.101 | ||||||
| PrepreG | 3.23 | 2.101 | ||||||
| 2 | GND | Copper | 0.689 | |||||
| CORE | 3.37 | 3.9 | ||||||
| 3 | SIGNAL | Copper | 0.689 |
50 ohm 55 ohm |
4 3.75 |
100ohm 95ohm 90ohm |
4-7-4 4-6-4 4-4.5-4 |
|
| PrepreG | 3.23 | 1.86 | ||||||
| PrepreG | 3.23 | 1.86 | ||||||
| 4 | GND | Copper | 0.689 | |||||
| CORE | 3.37 | 3.9 | ||||||
| 5 | SIGNAL | Copper | 0.689 |
50 ohm 55 ohm |
4 3.75 |
100ohm 95ohm 90ohm |
4-7-4 4-6-4 4-4.5-4 |
|
| PrepreG | 3.23 | 1.86 | ||||||
| PrepreG | 3.23 | 1.86 | ||||||
| 6 | GND | Copper | 0.689 | |||||
| CORE | 3.37 | 3.9 | ||||||
| 7 | SIGNAL | Copper | 0.689 |
50 ohm 55 ohm |
4 3.75 |
100ohm 95ohm 90ohm |
4-7-4 4-6-4 4-4.5-4 |
|
| PrepreG | 3.23 | 1.86 | ||||||
| PrepreG | 3.23 | 1.86 | ||||||
| 8 | GND | Copper | 0.689 | |||||
| CORE | 3.37 | 3.9 | ||||||
| 9 | POWER | Copper | 2.638 | |||||
| PrepreG | 3.23 | 0.788 | ||||||
| PrepreG | 3.23 | 0.788 | ||||||
| 10 | GND | Copper | 2.638 | |||||
| core | 3.37 | 3.9 | ||||||
| 11 | POWER | Copper | 2.638 | |||||
| PrepreG | 3.23 | 0.788 | ||||||
| PrepreG | 3.23 | 0.788 | ||||||
| 12 | POWER | Copper | 2.638 | |||||
| core | 3.37 | 3.9 | ||||||
| 13 | GND | Copper | 0.689 | |||||
| PrepreG | 3.23 | 1.86 | ||||||
| PrepreG | 3.23 | 1.86 | ||||||
| 14 | SIGNAL | Copper | 0.689 |
50 ohm 55 ohm |
4 3.75 |
100ohm 95ohm 90ohm |
4-7-4 4-6-4 4-4.5-4 |
|
| CORE | 3.37 | 3.9 | ||||||
| 15 | GND | Copper | 0.689 | |||||
| PrepreG | 3.23 | 1.86 | ||||||
| PrepreG | 3.23 | 1.86 | ||||||
| 16 | SIGNAL | Copper | 0.689 |
50 ohm 55 ohm |
4 3.75 |
100ohm 95ohm 90ohm |
4-7-4 4-6-4 4-4.5-4 |
|
| CORE | 3.37 | 3.9 | ||||||
| 17 | GND | Copper | 0.689 | |||||
| PrepreG | 3.23 | 1.86 | ||||||
| PrepreG | 3.23 | 1.86 | ||||||
| 18 | SIGNAL | Copper | 0.689 |
50 ohm 55 ohm |
4 3.75 |
100ohm 95ohm 90ohm |
4-7-4 4-6-4 4-4.5-4 |
|
| CORE | 3.37 | 3.9 | ||||||
| 19 | GND | Copper | 0.689 | |||||
| PrepreG | 3.23 | 2.101 | ||||||
| PrepreG | 3.23 | 2.101 | ||||||
| 20 | SOLDER |
Copper Foil 12 microns
|
1.772 |
50 ohm 55 ohm |
7 6 |
100ohm 95ohm 90ohm |
5-8-5 5-6.5-5 5-5.5-5 |
|
| MASK | 2.0 |
Company Details
Business Type:
Manufacturer
Year Established:
2007
Total Annual:
25,000,000-30,000,000
Employee Number:
200~300
Ecer Certification：
Active Member
Witgain Technology Limited was established in 2007. Factories locate in HuiZhou City and marketing locates in ShenZhen City. The total area of two factories is around 10000 square meters. We can offer 2-layer and multi-layer pcb services to our customers, highest to 24 layers and rigid-flex pcb, cer... Witgain Technology Limited was established in 2007. Factories locate in HuiZhou City and marketing locates in ShenZhen City. The total area of two factories is around 10000 square meters. We can offer 2-layer and multi-layer pcb services to our customers, highest to 24 layers and rigid-flex pcb, cer...
Get in touch with us
Leave a Message, we will call you back quickly!