Payment Terms | T/T |
Supply Ability | 20k pcs/month |
Delivery Time | 30 days |
Packaging Details | Vacuum bubble bag packaging |
No of layers: | 16 layers |
Silkscreen | White |
PTH Wall Copper | 25 UM |
Finished Thickness | 2.0 MM |
Surface technics: | ENIG 2U' |
Min Lind Space&Width: | 3/3 mil |
Brand Name | WITGAIN PCB |
Model Number | Multi-Layer PCB0025 |
Certification | UL |
Place of Origin | China |
View Detail Information
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Product Specification
Payment Terms | T/T | Supply Ability | 20k pcs/month |
Delivery Time | 30 days | Packaging Details | Vacuum bubble bag packaging |
No of layers: | 16 layers | Silkscreen | White |
PTH Wall Copper | 25 UM | Finished Thickness | 2.0 MM |
Surface technics: | ENIG 2U' | Min Lind Space&Width: | 3/3 mil |
Brand Name | WITGAIN PCB | Model Number | Multi-Layer PCB0025 |
Certification | UL | Place of Origin | China |
High Light | 16 Layer Multilayer Circuit Board ,2.0 MM Multilayer Circuit Board ,multilayer pcb board |
Multilayer Circuit Board 16 Layer PCB 2.0 MM Thickness
PCB Specifications:
1 Part NO: Multi-Layer PCB0025
2 Layer Count: 16 Layer PCB
3 Finished Board Thickness: 2.0MM
4 Copper Thickness: 1/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H/H1
5 Min Lind Space&Width: 3/3mil
6 Application Area: Industrial Control
Material Data Sheet:
S1130 | |||||
Items | Method | Condition | Unit | Typical Value | |
Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 135 | |
Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 310 | |
CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 65 | |
After Tg | ppm/℃ | 310 | |||
50-260℃ | % | 4.5 | |||
T260 | IPC-TM-650 2.4.24.1 | TMA | min | 13 | |
T288 | IPC-TM-650 2.4.24.1 | TMA | min | <1 | |
Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | -- | 60S No Delamination | |
Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 4.8E + 08 | |
E-24/125 | MΩ.cm | 4.6E + 06 | |||
Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 5.2E + 07 | |
E-24/125 | MΩ | 5.3E + 06 | |||
Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 120 | |
Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 60 | |
Electrical Strength | IPC-TM-650 2.5.6.2 | D-48/50+D-4/23 | kV/mm | — | |
Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 4.6 | |
IEC 61189-2-721 | 10GHz | -- | — | ||
Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 0.016 | |
IEC 61189-2-721 | 10GHz | -- | — | ||
Peel Strength(1oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
After thermal Stress 288℃,10s | N/mm | 1.8 | |||
125℃ | N/mm | 1.6 | |||
Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 600 |
CW | IPC-TM-650 2.4.4 | A | MPa | 500 | |
Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.15 | |
CTI | IEC30112 | C-48/23/50, | ℃ | PLC 3 | |
Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
E-24/125 | Rating | V-0 |
Layer Stackup:
Layer No. | Layer Type | Di-electric (Prepreg/ Core) |
Di-electric constant |
Processed Thickness (mil) |
Target Impedance - Single Ended (+/- 10%) |
Trace Width (Single ended) (mil) |
Target Impedance – differential (+/- 10%) |
Trace Width/ separation (differential pair) (mil) |
MASK | 4.0 | 2.0 | ||||||
1 | TOP |
Copper Foil 12 microns
|
1.772 |
50 ohm 55 ohm |
7 6 |
100ohm 95ohm 90ohm |
5-8-5 5-6.5-5 5-5.5-5 |
|
PrepreG | 3.23 | 2.101 | ||||||
PrepreG | 3.23 | 2.101 | ||||||
2 | GND | Copper | 0.689 | |||||
CORE | 3.37 | 3.9 | ||||||
3 | SIGNAL | Copper | 0.689 |
50 ohm 55 ohm |
4 3.75 |
100ohm 95ohm 90ohm |
4-7-4 4-6-4 4-4.5-4 |
|
PrepreG | 3.23 | 1.86 | ||||||
PrepreG | 3.23 | 1.86 | ||||||
4 | GND | Copper | 0.689 | |||||
CORE | 3.37 | 3.9 | ||||||
5 | SIGNAL | Copper | 0.689 |
50 ohm 55 ohm |
4 3.75 |
100ohm 95ohm 90ohm |
4-7-4 4-6-4 4-4.5-4 |
|
PrepreG | 3.23 | 1.86 | ||||||
PrepreG | 3.23 | 1.86 | ||||||
6 | GND | Copper | 0.689 | |||||
CORE | 3.37 | 3.9 | ||||||
7 | SIGNAL | Copper | 0.689 |
50 ohm 55 ohm |
4 3.75 |
100ohm 95ohm 90ohm |
4-7-4 4-6-4 4-4.5-4 |
|
PrepreG | 3.23 | 1.86 | ||||||
PrepreG | 3.23 | 1.86 | ||||||
8 | GND | Copper | 0.689 | |||||
CORE | 3.37 | 3.9 | ||||||
9 | POWER | Copper | 2.638 | |||||
PrepreG | 3.23 | 0.788 | ||||||
PrepreG | 3.23 | 0.788 | ||||||
10 | GND | Copper | 2.638 | |||||
core | 3.37 | 3.9 | ||||||
11 | POWER | Copper | 2.638 | |||||
PrepreG | 3.23 | 0.788 | ||||||
PrepreG | 3.23 | 0.788 | ||||||
12 | POWER | Copper | 2.638 | |||||
core | 3.37 | 3.9 | ||||||
13 | GND | Copper | 0.689 | |||||
PrepreG | 3.23 | 1.86 | ||||||
PrepreG | 3.23 | 1.86 | ||||||
14 | SIGNAL | Copper | 0.689 |
50 ohm 55 ohm |
4 3.75 |
100ohm 95ohm 90ohm |
4-7-4 4-6-4 4-4.5-4 |
|
CORE | 3.37 | 3.9 | ||||||
15 | GND | Copper | 0.689 | |||||
PrepreG | 3.23 | 1.86 | ||||||
PrepreG | 3.23 | 1.86 | ||||||
16 | SIGNAL | Copper | 0.689 |
50 ohm 55 ohm |
4 3.75 |
100ohm 95ohm 90ohm |
4-7-4 4-6-4 4-4.5-4 |
|
CORE | 3.37 | 3.9 | ||||||
17 | GND | Copper | 0.689 | |||||
PrepreG | 3.23 | 1.86 | ||||||
PrepreG | 3.23 | 1.86 | ||||||
18 | SIGNAL | Copper | 0.689 |
50 ohm 55 ohm |
4 3.75 |
100ohm 95ohm 90ohm |
4-7-4 4-6-4 4-4.5-4 |
|
CORE | 3.37 | 3.9 | ||||||
19 | GND | Copper | 0.689 | |||||
PrepreG | 3.23 | 2.101 | ||||||
PrepreG | 3.23 | 2.101 | ||||||
20 | SOLDER |
Copper Foil 12 microns
|
1.772 |
50 ohm 55 ohm |
7 6 |
100ohm 95ohm 90ohm |
5-8-5 5-6.5-5 5-5.5-5 |
|
MASK | 2.0 |
Company Details
Business Type:
Manufacturer
Year Established:
2007
Total Annual:
25,000,000-30,000,000
Employee Number:
200~300
Ecer Certification:
Active Member
Witgain Technology Limited was established in 2007. Factories locate in HuiZhou City and marketing locates in ShenZhen City. The total area of two factories is around 10000 square meters. We can offer 2-layer and multi-layer pcb services to our customers, highest to 24 layers and rigid-flex pcb, cer... Witgain Technology Limited was established in 2007. Factories locate in HuiZhou City and marketing locates in ShenZhen City. The total area of two factories is around 10000 square meters. We can offer 2-layer and multi-layer pcb services to our customers, highest to 24 layers and rigid-flex pcb, cer...
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