Payment Terms | T/T |
Supply Ability | 100k pcs/month |
Delivery Time | 20 days |
Packaging Details | Vacuum bubble bag packaging |
No of layers | 8 layers |
Solder Mask | Red Solder Mask |
Min Hole Size | 0.15MM |
CU Thickness | 1 OZ |
Impedance Control | 50 ohm |
Min Lind Space&Width | 3.5/3.5 mil |
Brand Name | WITGAIN PCB |
Model Number | Multi-Layer PCB000352 |
Certification | UL |
Place of Origin | China |
View Detail Information
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Product Specification
Payment Terms | T/T | Supply Ability | 100k pcs/month |
Delivery Time | 20 days | Packaging Details | Vacuum bubble bag packaging |
No of layers | 8 layers | Solder Mask | Red Solder Mask |
Min Hole Size | 0.15MM | CU Thickness | 1 OZ |
Impedance Control | 50 ohm | Min Lind Space&Width | 3.5/3.5 mil |
Brand Name | WITGAIN PCB | Model Number | Multi-Layer PCB000352 |
Certification | UL | Place of Origin | China |
High Light | Red Solder Mask FR4 Circuit Board ,1OZ Copper FR4 Circuit Board ,OSP Treatment Multilayer Circuit Board |
Red Solder Mask FR4 Substrate Material 1 OZ Copper Thickness OSP Treatment
PCB Specifications:
1 Part NO: Multi-Layer PCB000351
2 Layer Count: 8 Layer PCB
3 Finished Board Thickness: 1.6MM
4 Copper Thickness: 1/1/1/1/1/1 OZ
5 Min Lind Space&Width: 3.5/3.5 mil
6 Application Area: Amplifier
Material Data Sheet:
S1000-2 | |||||
Items | Method | Condition | Unit | Typical Value | |
Tg | IPC-TM-650 2.4.25 | DSC | ℃ | 180 | |
IPC-TM-650 2.4.24.4 | DMA | ℃ | 185 | ||
Td | IPC-TM-650 2.4.24.6 | 5% wt. loss | ℃ | 345 | |
CTE (Z-axis) | IPC-TM-650 2.4.24 | Before Tg | ppm/℃ | 45 | |
After Tg | ppm/℃ | 220 | |||
50-260℃ | % | 2.8 | |||
T260 | IPC-TM-650 2.4.24.1 | TMA | min | 60 | |
T288 | IPC-TM-650 2.4.24.1 | TMA | min | 20 | |
T300 | IPC-TM-650 2.4.24.1 | TMA | min | 5 | |
Thermal Stress | IPC-TM-650 2.4.13.1 | 288℃, solder dip | -- | 100S No Delamination | |
Volume Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ.cm | 2.2 x 108 | |
E-24/125 | MΩ.cm | 4.5 x 106 | |||
Surface Resistivity | IPC-TM-650 2.5.17.1 | After moisture resistance | MΩ | 7.9 x 107 | |
E-24/125 | MΩ | 1.7 x 106 | |||
Arc Resistance | IPC-TM-650 2.5.1 | D-48/50+D-4/23 | s | 100 | |
Dielectric Breakdown | IPC-TM-650 2.5.6 | D-48/50+D-4/23 | kV | 63 | |
Dissipation Constant (Dk) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 4.8 | |
IEC 61189-2-721 | 10GHz | -- | — | ||
Dissipation Factor (Df) | IPC-TM-650 2.5.5.9 | 1MHz | -- | 0.013 | |
IEC 61189-2-721 | 10GHz | -- | — | ||
Peel Strength (1Oz HTE copper foil) | IPC-TM-650 2.4.8 | A | N/mm | — | |
After thermal Stress 288℃,10s | N/mm | 1.38 | |||
125℃ | N/mm | 1.07 | |||
Flexural Strength | LW | IPC-TM-650 2.4.4 | A | MPa | 562 |
CW | IPC-TM-650 2.4.4 | A | MPa | 518 | |
Water Absorption | IPC-TM-650 2.6.2.1 | E-1/105+D-24/23 | % | 0.1 | |
CTI | IEC60112 | A | Rating | PLC 3 | |
Flammability | UL94 | C-48/23/50 | Rating | V-0 | |
E-24/125 | Rating | V-0 |
FAQ:
Q1: What are PCB Mouse bites?
A1:
Mouse bites also known as perforated breakaway tabs in a PCB are small perforations / pricks on the board which allow for panelizing and depanelizing smaller groups of PCBs together. This way multiple PCB boards can be assembled together, thereby saving time and making the process cost-effective. The assembled PCBs can be separated by applying pressure on the sections of the board that have perforations. Once separated, i.e after the depanelization process, the board looks like it has mouse bites in these sections.
Below is an Image of PCBs assembled to each other with the help of mouse bites.
Below is an Image of a PCB being depaneled easily which is also made possible due to mouse bites. You can also see the sharp edges after the boards have been separated, these are called mouse bites.
When multiple PCBs are connected using mouse bites they have a smooth finish. When compared to PCB boards connected using V-Scoring, boards connected with mouse bites are easier to depanelize i.e they require less force.
Precautions to take before inserting Mouse bites on a PCB
Company Details
Business Type:
Manufacturer
Year Established:
2007
Total Annual:
25,000,000-30,000,000
Employee Number:
200~300
Ecer Certification:
Active Member
Witgain Technology Limited was established in 2007. Factories locate in HuiZhou City and marketing locates in ShenZhen City. The total area of two factories is around 10000 square meters. We can offer 2-layer and multi-layer pcb services to our customers, highest to 24 layers and rigid-flex pcb, cer... Witgain Technology Limited was established in 2007. Factories locate in HuiZhou City and marketing locates in ShenZhen City. The total area of two factories is around 10000 square meters. We can offer 2-layer and multi-layer pcb services to our customers, highest to 24 layers and rigid-flex pcb, cer...
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