Suntek Electronics Co., Ltd.
Products
Manufacturer of a wide range of products which include Thick Copper 5OZ pcb fabrication and assembly,Thick Copper 5OZ Printed Circuit Board Assembly Services For Surge Protection,HDI Board with 8OZ Max Copper Thickness 0201 Min pa...
MOQ: 1
Price: Customized products
| Payment Terms | TT,Paypal |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material | FR4(Tg130-Tg180) |
| Thickness | 0.4mm-5mm |
| Layer | 1L-32L |
| Size at max. | 1200*400mm |
| Hole min. | 0.1mm |
| LW/LS min. | 0.05mm |
| Copper | 0.5--10OZ |
| Surface | HASL,ENIG,OSP,Hard plating,Immersion Tin |
| Solder mask | Green,Blue,Black,Red,White,Matt color |
| Brand Name | Suntek |
| Model Number | F016-006 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China or Cambodia |
MOQ: 1
Price: Customized products
| Payment Terms | TT,Paypal |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material | FR4(Tg130-Tg180) |
| Thickness | 0.4mm-5mm |
| Layer | 1L-32L |
| Size at max. | 1200*400mm |
| Hole min. | 0.1mm |
| LW/LS min. | 0.05mm |
| Copper | 0.5--10OZ |
| Brand Name | Suntek |
| Model Number | F016-006 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China or Cambodia |
MOQ: 5pcs
Price: Based on Gerber
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks |
| Packaging Details | cartons and ESD bags |
| Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
| Build-up Material | RCC,FR4 |
| Max Layer | 38L |
| Min Hole mm(mil) | 0.2(8) |
| Min Land mm(mil) | 0.4(16) |
| Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
| Laser Hole Filling | Yes |
| Max Copper Thickness | 8OZ |
| Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
| Brand Name | Suntek |
| Model Number | F5665 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: Based on Gerber
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks |
| Packaging Details | cartons and ESD bags |
| Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
| Build-up Material | RCC,FR4 |
| Max Layer | 38L |
| Min Hole mm(mil) | 0.2(8) |
| Min Land mm(mil) | 0.4(16) |
| Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
| Laser Hole Filling | Yes |
| Max Copper Thickness | 8OZ |
| Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
| Tolerance of PTH | +/-0.05mm |
| Brand Name | Suntek |
| Model Number | F56 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: Based on Gerber
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks |
| Packaging Details | cartons and ESD bags |
| Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
| Build-up Material | RCC,FR4 |
| Max Layer | 38L |
| Min Hole mm(mil) | 0.2(8) |
| Min Land mm(mil) | 0.4(16) |
| Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
| Laser Hole Filling | Yes |
| Max Copper Thickness | 8OZ |
| Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
| Tolerance of PTH | +/-0.05mm |
| Brand Name | Suntek |
| Model Number | F561 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: Based on Gerber
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks |
| Packaging Details | cartons and ESD bags |
| Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
| Build-up Material | RCC,FR4 |
| Max Layer | 38L |
| Min Hole mm(mil) | 0.2(8) |
| Min Land mm(mil) | 0.4(16) |
| Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
| Laser Hole Filling | Yes |
| Max Copper Thickness | 8OZ |
| Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
| Impedance Contronl | +/-10% |
| Brand Name | Suntek |
| Model Number | F568 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: Based on Gerber
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks after all parts collected |
| Packaging Details | 60*40*30cm cartons and ESD bags |
| Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
| Build-up Material | RCC,FR4 |
| Max Layer | 38L |
| Min Hole mm(mil) | 0.2(8) |
| Min Land mm(mil) | 0.4(16) |
| Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
| Laser Hole Filling | Yes |
| Max Copper Thickness | 8OZ |
| Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
| Brand Name | Suntek |
| Model Number | F5665 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: Based on Gerber
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks after all parts collected |
| Packaging Details | 60*40*30cm cartons and ESD bags |
| Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
| Build-up Material | RCC,FR4 |
| Max Layer | 38L |
| Min Hole mm(mil) | 0.2(8) |
| Min Land mm(mil) | 0.4(16) |
| Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
| Laser Hole Filling | Yes |
| Max Copper Thickness | 8OZ |
| Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
| Brand Name | Suntek |
| Model Number | F5665 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: 5pcs
Price: Based on Gerber
| Payment Terms | T/T,Paypal |
| Supply Ability | 100pcs/hour |
| Delivery Time | 1-2 weeks after all parts collected |
| Packaging Details | 60*40*30cm cartons and ESD bags |
| Base Material | Fr4,Rogers,Getek,Halogen free,Low Dk/Low Df |
| Build-up Material | RCC,FR4 |
| Max Layer | 38L |
| Min Hole mm(mil) | 0.2(8) |
| Min Land mm(mil) | 0.4(16) |
| Min IVH Hole/Land Size um(mil) | 150/300(6/12) |
| Laser Hole Filling | Yes |
| Max Copper Thickness | 8OZ |
| Surface Finish | ENIG/OSP/HASL/Au Plating/Immersion Tin |
| Brand Name | Suntek |
| Model Number | F5665 |
| Certification | ISO9001, ISO13485, TS16949 and UL E476377 |
| Place of Origin | China/Cambodia |
MOQ: 1pcs
Price: Customized products
| Payment Terms | TT,Paypal |
| Delivery Time | 5-7days after all components kitted |
| Packaging Details | By ESD bags and carton |
| Material | FR4 |
| Copper | 35um |
| Impedance control | Yes |
| Surface Finish | HASL,ENIG,OSP,Hard plating,Immersion Tin |
| Thickness | 1.6 mm |
| Layer | 4Layers |
| silkscreen color | white,black |
| X-RAY inspection | For BGA,OFN,QFP with bottom pads |
| soldering mask color | Green |
| internal copper | 1.2mil |
| Brand Name | Suntek Electronics Co., Ltd |
| Model Number | 2024-PCBA-074 |
| Certification | ISO9001 ISO13485 IATF16949 UL |
| Place of Origin | China |
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