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Shanghai GaNova Electronic Information Co., Ltd.

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Silicon Wafer

Manufacturer of a wide range of products which include Boost Production Rapid Thermal Processing RTP-SA-8 Annealing System,150mm Rapid Thermal Annealing System With Three Sets Process Gases,0.001-100 ohm-cm Silicon Wafer P Type Bo...

Quality Boost Production Rapid Thermal Processing RTP-SA-8 Annealing System for sale

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Boost Production Rapid Thermal Processing RTP-SA-8 Annealing System

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Payment Terms T/T
Delivery Time 3 month
Maximum product size 8-inch and below wafers
Equipment dimensions 970mm x 1450mm x 2024mm (width x depth x height)
Heating temperature range Room temperature~~800 ℃ (thermocouple) 800 ℃~1250 ℃ (infrared pyrometer)
heating rate 150 ℃/s bare wafer 20 ℃/s silicon carbide carrier
Temperature uniformity < 500 ℃, uniformity ≤ ± 5 ℃ ≥ 500 ℃, uniformity ≤ ± 1%
Temperature control repeatability ±1℃
Constant temperature duration Programmable according to requirements
Brand Name Ganova
Model Number RTP-SA-8
Place of Origin China

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Quality 150mm Rapid Thermal Annealing System With Three Sets Process Gases for sale

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150mm Rapid Thermal Annealing System With Three Sets Process Gases

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Payment Terms T/T
Delivery Time 8-10week days
Product Name Rapid Thermal Annealing System
Model RTP-150RL
Maximum sample size 150mm
Process gases three sets
Software control system RL900
temperature control Tube power PID
Brand Name GaNova
Model Number JDEQ-0002
Place of Origin Suzhou China

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Quality 0.001-100 ohm-cm Silicon Wafer P Type Boron Dopant for sale

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0.001-100 ohm-cm Silicon Wafer P Type Boron Dopant

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Payment Terms T/T
Supply Ability 50000pcs/month
Delivery Time 3-4 week days
Packaging Details Vacuum packing in a class 10000 clean room environment,in cassettes of 25pcs or single wafer containers.
Diameter 2"
Grade Prime
Growth Method CZ
Orientation <1-0-0>,<1-1-1>,<1-1-0>
Type/Dopant P Type/Boron,N Type/Phos,N Type/As, N Type/Sb
Thickness(μm) 279
Thickness Tolerance Standard ± 25μm,Maximum Capabilities ± 5μm
Resistivity 0.001-100 ohm-cm
Surface Finished P/E,P/P,E/E,G/G
TTV(μm) Standard <10μm,Maximum Capabilities<5μm
Bow/Warp Standard <40μm,Maximum Capabilities<20μm
Particle <10@0.5μm; <10@0.3μm; <10@0.2μm;
Brand Name GaNova
Certification UKAS/ISO9001:2015
Place of Origin Suzhou China
Model Number JDCD06-001-002

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Quality Discrete Devices Si Substrates P/E P/P E/E G/G Surface Finished for sale

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Discrete Devices Si Substrates P/E P/P E/E G/G Surface Finished

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Payment Terms T/T
Supply Ability 50000pcs/month
Delivery Time 3-4 week days
Packaging Details Vacuum packing in a class 10000 clean room environment,in cassettes of 25pcs or single wafer containers.
Growth Method CZ
Diameter 2"
Grade Prime
Orientation <1-0-0>,<1-1-1>,<1-1-0>
Thickness(μm) 279
Thickness Tolerance Standard ± 25μm,Maximum Capabilities ± 5μm
Resistivity 0.001-100 ohm-cm
Surface Finished P/E,P/P,E/E,G/G
Brand Name GaNova
Certification UKAS/ISO9001:2015
Place of Origin Suzhou China
Model Number JDCD06-001-002

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Quality Prime 2'' Silicon Wafer Standard <10 μm Maximum Capabilities<5um for sale

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Prime 2'' Silicon Wafer Standard <10 μm Maximum Capabilities<5um

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Payment Terms T/T
Supply Ability 50000pcs/month
Delivery Time 3-4 week days
Packaging Details Vacuum packing in a class 10000 clean room environment,in cassettes of 25pcs or single wafer containers.
Diameter 2"
Grade Prime
Growth Method CZ
Resistivity 0.001-100 ohm-cm
Surface Finished P/E,P/P,E/E,G/G
TTV(μm) Standard <10μm,Maximum Capabilities<5μm
Bow/Warp Standard <40μm,Maximum Capabilities<20μm
Particle <10@0.5μm; <10@0.3μm; <10@0.2μm;
Brand Name GaNova
Certification UKAS/ISO9001:2015
Place of Origin Suzhou China
Model Number JDCD06-001-002

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Quality Microelectronic 279um Silicon Epitaxial Wafer Primary Substrate for sale

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Microelectronic 279um Silicon Epitaxial Wafer Primary Substrate

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Payment Terms T/T
Supply Ability 50000pcs/month
Delivery Time 3-4 week days
Packaging Details Vacuum packing in a class 10000 clean room environment,in cassettes of 25pcs or single wafer containers.
Grade Prime
Growth Method CZ
Type/Dopant P Type/Boron,N Type/Phos,N Type/As, N Type/Sb
Thickness(μm) 279
Thickness Tolerance Standard ± 25μm,Maximum Capabilities ± 5μm
Resistivity 0.001-100 ohm-cm
Surface Finished P/E,P/P,E/E,G/G
TTV(μm) Standard <10μm,Maximum Capabilities<5μm
Brand Name GaNova
Certification UKAS/ISO9001:2015
Place of Origin Suzhou China
Model Number JDCD06-001-002

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Quality N Type Phos Silicon Wafer 3

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N Type Phos Silicon Wafer 3" Thickness 279um 380um 525um 625um

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Payment Terms T/T
Supply Ability 50000pcs/month
Delivery Time 3-4 week days
Packaging Details Vacuum packing in a class 10000 clean room environment,in cassettes of 25pcs or single wafer containers.
Type/Dopant P Type/Boron,N Type/Phos,N Type/As, N Type/Sb
Thickness(μm) 279
Thickness Tolerance Standard ± 25μm,Maximum Capabilities ± 5μm
Resistivity 0.001-100 ohm-cm
Surface Finished P/E,P/P,E/E,G/G
TTV(μm) Standard <10 μm,Maximum Capabilities<5 μm
Bow/Warp Standard <40 μm,Maximum Capabilities<20 μm
Particle <10@0.5μm; <10@0.3μm; <10@0.2μm;
Brand Name GaNova
Certification UKAS/ISO9001:2015
Place of Origin Suzhou China
Model Number JDCD06-001-003

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Quality 4

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4" 5" 6" Si Wafer P Type / Boron N Type / As N Type / Sb

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Payment Terms T/T
Supply Ability 50000pcs/month
Delivery Time 3-4 week days
Packaging Details Vacuum packing in a class 10000 clean room environment,in cassettes of 25pcs or single wafer containers.
Diameter 2"
Grade Prime
Growth Method CZ
Orientation <1-0-0>,<1-1-1>,<1-1-0>
Type/Dopant P Type/Boron,N Type/Phos,N Type/As, N Type/Sb
Thickness(μm) 279
Thickness Tolerance Standard ± 25μm,Maximum Capabilities ± 5μm
Resistivity 0.001-100 ohm-cm
Surface Finished P/E,P/P,E/E,G/G
TTV(μm) Standard <10μm,Maximum Capabilities<5μm
Bow/Warp Standard <40μm,Maximum Capabilities<20μm
Particle <10@0.5μm; <10@0.3μm; <10@0.2μm;
Brand Name GaNova
Certification UKAS/ISO9001:2015
Place of Origin Suzhou China
Model Number JDCD06-001-002

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Quality Growth Method CZ Silicon Wafer 5, <1-1-1>, <1-1-0> for sale">

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Growth Method CZ Silicon Wafer 5" Orientation <1-0-0>, <1-1-1>, <1-1-0>

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Payment Terms T/T
Supply Ability 50000pcs/month
Delivery Time 3-4 week days
Packaging Details Vacuum packing in a class 10000 clean room environment,in cassettes of 25pcs or single wafer containers.
Diameter 2"
Grade Prime
Growth Method CZ
Orientation <1-0-0>,<1-1-1>,<1-1-0>
Thickness(μm) 279
Thickness Tolerance Standard ± 25μm,Maximum Capabilities ± 5μm
Resistivity 0.001-100 ohm-cm
Surface Finished P/E,P/P,E/E,G/G
Brand Name GaNova
Certification UKAS/ISO9001:2015
Place of Origin Suzhou China
Model Number JDCD06-001-002

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Quality Semiconductor Devices 2 Inch Silicon Substrate Wafer 8'' 12'' for sale

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Semiconductor Devices 2 Inch Silicon Substrate Wafer 8'' 12''

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Payment Terms T/T
Supply Ability 50000pcs/month
Delivery Time 3-4 week days
Packaging Details Vacuum packing in a class 10000 clean room environment,in cassettes of 25pcs or single wafer containers.
Diameter 2"
Grade Prime
Growth Method CZ
Orientation <1-0-0>,<1-1-1>,<1-1-0>
Type/Dopant P Type/Boron,N Type/Phos,N Type/As, N Type/Sb
Thickness(μm) 279
Thickness Tolerance Standard ± 25μm,Maximum Capabilities ± 5μm
Resistivity 0.001-100 ohm-cm
Surface Finished P/E,P/P,E/E,G/G
TTV(μm) Standard <10μm,Maximum Capabilities<5μm
Bow/Warp Standard <40μm,Maximum Capabilities<20μm
Particle <10@0.5μm; <10@0.3μm; <10@0.2μm;
Brand Name GaNova
Certification UKAS/ISO9001:2015
Place of Origin Suzhou China
Model Number JDCD06-001-002

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  • Shanghai GaNova Electronic Information Co., Ltd.
  • Building 11, Lane 1333, Jiangnan Avenue, Changxing Town, Chongming District, Shanghai
  • https://www.epi-wafers.com/

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