Payment Terms | T/T |
Supply Ability | 100000pc/Month |
Delivery Time | 4 weeks |
Packaging Details | PCB + Box |
Keyword | Printed Circuit Board Fabrication |
Insulation | FR4 board, aluminum substrate, copper substrate, ceramic substrate, PI (polycumimine), PET (poly) |
Copper foil material | Glue-free calendered copper, rubber-rolled copper, glue-based electrolytic copper |
number | 1-12 floors |
The finished board is thick | 0.07MM AND ABOVE (TOLERANCE +5%) |
The inner layer is thick copper | 18-7OUM (1 ounce copper = 35UM) |
The outer layer is thick copper | 20-14OUM (1 plate copper = 35UM) |
Solder mask | Red oil, green oil, butter, blue oil, white oil, black oil, matte black oil, yellow film covered white film, black film |
word | Red, green, yellow, blue, white, black silver |
Surface treatment | Anti-oxidation (OSP), tin spraying, gold immersion, gold plating, silver plating nickel plating, gold plating finger, carbon oil |
Special processes | Thick copper plate, impedance plate, high frequency plate, half-hole plate, orifice plate, hollow plate, single-layer copper foil, cross-sided gold finger plate, soft and hard combination |
Reinforcement type | PI, FR4, steel sheet, 3M glue, electromagnetic shielding film |
Maximum size | 50OMM*1000MM |
Outer line width/line spacing | 0.065MM( 3MIL) |
Inner line width/line spacing | 0.065MM(3MIL) |
Minimum solder mask width | 0.10MM |
Minimum mask bridge width | 0.05MM |
Minimum solder mask | 0.45MM |
Minimum aperture | MECHANICAL DRILLING 0.2MM, LASER DRILLING 0,1MM |
Impedance tolerance | 10% of soil |
Form tolerances | +0.05MM(LASER+0.005MM) |
Molding method | V-cut, CNC, die punching, laser |
Brand Name | CUSTOM MADE |
Certification | ISO/UL |
Place of Origin | China |
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Product Specification
Payment Terms | T/T | Supply Ability | 100000pc/Month |
Delivery Time | 4 weeks | Packaging Details | PCB + Box |
Keyword | Printed Circuit Board Fabrication | Insulation | FR4 board, aluminum substrate, copper substrate, ceramic substrate, PI (polycumimine), PET (poly) |
Copper foil material | Glue-free calendered copper, rubber-rolled copper, glue-based electrolytic copper | number | 1-12 floors |
The finished board is thick | 0.07MM AND ABOVE (TOLERANCE +5%) | The inner layer is thick copper | 18-7OUM (1 ounce copper = 35UM) |
The outer layer is thick copper | 20-14OUM (1 plate copper = 35UM) | Solder mask | Red oil, green oil, butter, blue oil, white oil, black oil, matte black oil, yellow film covered white film, black film |
word | Red, green, yellow, blue, white, black silver | Surface treatment | Anti-oxidation (OSP), tin spraying, gold immersion, gold plating, silver plating nickel plating, gold plating finger, carbon oil |
Special processes | Thick copper plate, impedance plate, high frequency plate, half-hole plate, orifice plate, hollow plate, single-layer copper foil, cross-sided gold finger plate, soft and hard combination | Reinforcement type | PI, FR4, steel sheet, 3M glue, electromagnetic shielding film |
Maximum size | 50OMM*1000MM | Outer line width/line spacing | 0.065MM( 3MIL) |
Inner line width/line spacing | 0.065MM(3MIL) | Minimum solder mask width | 0.10MM |
Minimum mask bridge width | 0.05MM | Minimum solder mask | 0.45MM |
Minimum aperture | MECHANICAL DRILLING 0.2MM, LASER DRILLING 0,1MM | Impedance tolerance | 10% of soil |
Form tolerances | +0.05MM(LASER+0.005MM) | Molding method | V-cut, CNC, die punching, laser |
Brand Name | CUSTOM MADE | Certification | ISO/UL |
Place of Origin | China |
Elevate Your Electronics with Customized PCB Production Services
Innovative PCB Fabrication For Unsurpassed Quality And Flexibility
Key Steps In Printed Circuit Board Manufacturing:
1. Design: First, circuit board designers create circuit diagrams and layouts using computer-aided design (CAD) tools. This includes determining component locations, connections, and circuit paths.
2. Substrate Preparation: Non-conductive substrates are typically made from fiberglass-reinforced epoxy resin. These substrates are subsequently processed through cutting and lamination processes.
3. Conductive layer deposition: Deposition of conductive material (usually copper) on the surface of a substrate to form a circuit pattern. This can be done through chemistry, electroplating, or other techniques.
Patterning: Using photolithography or etching to remove unwanted portions of a conductive layer, leaving the desired circuit pattern.
4. Component placement: Use automated equipment to accurately place electronic components such as resistors, capacitors, and integrated circuits onto circuit boards.
5. Soldering: Components and circuit boards are connected through a soldering process. This can be done using surface-mount technology (SMT) or through-mount technology (THT).
6. Testing and Quality Control: Once completed, the board goes through a series of tests to ensure that all components are connected correctly and the circuit is working properly. The quality control process also includes visual inspection and measurement.
Printed Circuit Board Fabrication Parameters:
Name | Printed Circuit Board Fabrication | Reinforcement type | PI, FR4, steel sheet, 3M glue, the electromagnetic shielding film |
Insulation | FR4 board, aluminum substrate, copper substrate, a ceramic substrate, PI (polycumimine), PET (poly) | Maximum size | 50OMM*1000MM |
Copper foil material | Glue-free calendered copper, rubber-rolled copper, glue-based electrolytic copper | Outer line width/line spacing | 0.065MM( 3MIL) |
number | 1-12 floors | Inner line width/line spacing | 0.065MM(3MIL) |
The finished board is thick | 0.07MM AND ABOVE (TOLERANCE +5%) | Minimum solder mask width | 0.10MM |
The inner layer is thick copper | 18-7OUM (1 ounce copper = 35UM) | Minimum mask bridge width | 0.05MM |
The outer layer is thick copper | 20-14OUM (1 plate copper = 35UM) | Minimum solder mask | 0.45MM |
Solder mask | Red oil, green oil, butter, blue oil, white oil, black oil, matte black oil, yellow film covered white film, black film | Minimum aperture | MECHANICAL DRILLING 0.2MM, LASER DRILLING 0,1MM |
word | Red, green, yellow, blue, white, black silver | Impedance Tolerance | 10% of soil |
Surface treatment | Anti-oxidation (OSP), tin spraying, gold immersion, gold plating, silver plating nickel plating, gold plating finger, carbon oil | Form tolerances | +0.05MM(LASER+0.005MM) |
Special processes | Thick copper plate, impedance plate, high-frequency plate, half-hole plate, orifice plate, hollow plate, single-layer copper foil, cross-sided gold finger plate, soft and hard combination | Molding method | V-cut, CNC, die punching, laser |
Printed Circuit Board Fabrication Factory Introduction:
Tongzhan Industrial Ltd. was established in 2011 in Shenzhen, Guangdong Province. Tongzhan Industrial Ltd. is committed to becoming a leading one-stop EMS supplier company, providing customers with high-quality PCB series products. Tongzhan mainly focuses on high-speed turnkey PCB layout design and PCB assembly services, including PCB design, manufacturing, component procurement, PCBA design and board making, supply chain services, functional testing, conformal paint, complete assembly, etc. Our corporate culture is to serve customers, customers always come first. Customer-oriented, diligent and innovative, honest, happy, transparent, customer-centric, professional, efficient, and win-win. Our employees are passionate. Passion for Science. Passion for technology.
Company Details
Business Type:
Manufacturer
Year Established:
2011
Total Annual:
5000000-10000000
Employee Number:
50~100
Ecer Certification:
Active Member
High-Quality One-Stop EMS Provider - Tongzhan Industrial Ltd. Established in 2011 and located in Shenzhen, Guangdong Province, Tongzhan Industrial Ltd. is committed to becoming a leading one-stop Electronic Manufacturing Service (EMS) provider. We provide customers with top-quali... High-Quality One-Stop EMS Provider - Tongzhan Industrial Ltd. Established in 2011 and located in Shenzhen, Guangdong Province, Tongzhan Industrial Ltd. is committed to becoming a leading one-stop Electronic Manufacturing Service (EMS) provider. We provide customers with top-quali...
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